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TCM29C17J

Texas Instruments

TCM29C17J by Texas Instruments

TCM29C17J by Texas Instruments is an Audio Codec with A-LAW companding law, operating at +-5V. It features 16 terminals in a rectangular package style for synchronous/asynchronous operation. Ideal for PCM CODEC applications in telecom, with filter and commercial temperature grade.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,728 parts In-Stock

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5,728

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Digiode

USA . 2,646 parts In-Stock

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2,646

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Sogenti Electronics

Canada . 4 parts In-Stock

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Prism Electronics

USA . 3 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 500 parts In-Stock

1+ parts

$9.858

100+ parts

$9.858

1k+ parts

$9.858

10k+ parts

-

500

$9.858

$9.858

$9.858

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AZTECH Wire

Italy . 460 parts In-Stock

1+ parts

$11.690

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460

$11.690

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Parana Technologies

USA . 795 parts In-Stock

1+ parts

$12.382

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-

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$12.822

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795

$12.382

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$12.822

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ChromeModa Solutions

Germany . 4,644 parts In-Stock

1+ parts

$13.912

100+ parts

$11.408

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4,644

$13.912

$11.408

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IDEA Electronic Components Group

UK . 2,215 parts In-Stock

1+ parts

$13.912

100+ parts

$13.216

1k+ parts

$12.521

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2,215

$13.912

$13.216

$12.521

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One Stop Electronics

USA . 553 parts In-Stock

1+ parts

$225.000

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553

$225.000

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Corphita

USA . 2,039 parts In-Stock

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2,039

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DigiPath Technology Company

USA . 1,417 parts In-Stock

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$12.543

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1,417

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$12.543

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Overview

Enhance your audio systems with the TCM29C17J by Texas Instruments, a top-tier manufacturer known for delivering exceptional quality and reliability. As part of the Audio Codecs category, this product offers seamless synchronous/asynchronous operation with a compact rectangular package that ensures easy integration. Ideal for telecom applications, the TCM29C17J boasts a wide temperature range and low power consumption, making it a cost-effective solution for your audio processing needs. Elevate your sound experience with this high-performance PCM CODEC and enjoy unparalleled value and benefits that Texas Instruments is renowned for providing.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material ensures durability and protection for the internal components, making this codec suitable for various applications.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The ability to operate in both synchronous and asynchronous modes provides flexibility in different system configurations, making it versatile for different applications.

Power Supplies (V): +-5

The dual power supplies of +-5V allow for a wide range of power options and compatibility with different power sources, ensuring reliable performance.

Technology: CMOS

The CMOS technology used in this codec offers low power consumption and high noise immunity, making it efficient and reliable for audio processing tasks.

Telecom IC Type: PCM CODEC

Being a PCM codec specifically designed for telecommunications applications ensures high-quality audio encoding and decoding, making it ideal for telecom use cases.

Technical Specifications

Audio Codecs TCM29C17J attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

A-LAW

Filter:

YES

Maximum Gain Tolerance:

.08 dB

JESD-30 Code:

R-GDIP-T16

Length:

19.56 mm

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Codecs

Maximum Supply Current:

9 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

TCM29C17J Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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