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TLV320A1109PBSRG4

Texas Instruments

TLV320A1109PBSRG4 by Texas Instruments

TLV320A1109PBSRG4 by Texas Instruments is a 32-terminal audio codec with 15-bit linear coding and A/MU-LAW companding law. Operating at 3V, it has a max temperature of 85°C and is ideal for PCM codec applications in industrial settings. The package style is flatpack with thin profile, fine pitch, and gull wing terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,954 parts In-Stock

1+ parts

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1,954

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Digiode

USA . 1,746 parts In-Stock

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1,746

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 439 parts In-Stock

1+ parts

$13.574

100+ parts

-

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439

$13.574

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Parana Technologies

USA . 1,636 parts In-Stock

1+ parts

$14.359

100+ parts

$1,333.475

1k+ parts

$12.923

10k+ parts

-

1,636

$14.359

$1,333.475

$12.923

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DigiPath Technology Company

USA . 878 parts In-Stock

1+ parts

$15.811

100+ parts

$14.546

1k+ parts

-

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878

$15.811

$14.546

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ChromeModa Solutions

Germany . 2,965 parts In-Stock

1+ parts

$16.134

100+ parts

$13.230

1k+ parts

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2,965

$16.134

$13.230

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IDEA Electronic Components Group

UK . 475 parts In-Stock

1+ parts

$16.134

100+ parts

$15.327

1k+ parts

$14.521

10k+ parts

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475

$16.134

$15.327

$14.521

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$20.290

100+ parts

$18.464

1k+ parts

$16.638

10k+ parts

-

2,500

$20.290

$18.464

$16.638

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One Stop Electronics

USA . 427 parts In-Stock

1+ parts

$755.000

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427

$755.000

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Corphita

USA . 2,619 parts In-Stock

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2,619

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Microchip USA

USA . 230 parts In-Stock

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230

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Overview

Experience superior audio quality with the TLV320A1109PBSRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unmatched reliability and performance in their Audio Codecs category. This versatile product is perfect for a wide range of applications. From telecommunications to consumer electronics, this PCM CODEC offers exceptional value and benefits. Upgrade your audio experience today with the TLV320A1109PBSRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the product lightweight and durable, ideal for use in a variety of applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures accurate and synchronized data processing.

Power Supplies (V): 3

The 3V power supply is common and easily accessible, making it convenient for various setups.

No. of Terminals: 32

With 32 terminals, this codec offers versatile connectivity options for a range of audio systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this codec suitable for use in various environments.

Technology: CMOS

The CMOS technology ensures efficient and reliable performance while consuming low power.

Technical Specifications

Audio Codecs TLV320A1109PBSRG4 attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

A/MU-LAW

Filter:

YES

Maximum Gain Tolerance:

1 dB

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e4

Length:

5 mm

Linear Coding:

15-BIT

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP32,.28SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Codecs

Maximum Supply Current:

.008 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

TLV320A1109PBSRG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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