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TP3067WM

Texas Instruments

TP3067WM by Texas Instruments

TP3067WM by Texas Instruments is an Audio Codec with 20 terminals, operating at temperatures from 0 to 70°C. It features a companding law of A-LAW and operates on +-5V power supplies. Ideal for PCM codec applications in the commercial temperature grade range.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,443 parts In-Stock

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Digiode

USA . 2,929 parts In-Stock

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2,929

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Anansix

USA . 1,573 parts In-Stock

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Prism Electronics

USA . 10 parts In-Stock

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AZTECH Wire

Italy . 382 parts In-Stock

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$5.923

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382

$5.923

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Parana Technologies

USA . 2,127 parts In-Stock

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$11.861

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$12.259

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$12.259

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ChromeModa Solutions

Germany . 6,041 parts In-Stock

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$13.327

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$10.928

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$13.327

$10.928

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IDEA Electronic Components Group

UK . 268 parts In-Stock

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$13.327

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$12.661

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$11.994

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268

$13.327

$12.661

$11.994

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One Stop Electronics

USA . 1,506 parts In-Stock

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$632.000

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Lixinc

USA . 11,168 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,901 parts In-Stock

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Corphita

USA . 778 parts In-Stock

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Perfect Parts

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Microchip USA

USA . 458 parts In-Stock

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Kepictronics

USA . 409 parts In-Stock

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DigiPath Technology Company

USA . 275 parts In-Stock

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$12.016

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$12.016

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Assy Fe

Spain . 29 parts In-Stock

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Overview

Experience crystal-clear audio quality like never before with the TP3067WM by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch audio codecs that are perfect for a wide range of applications. Whether you're looking to enhance your communication systems or upgrade your audio equipment, this product offers unbeatable value, benefits, and advantages. Say goodbye to distorted sound and hello to superior performance with the TP3067WM. Trust Texas Instruments to deliver excellence in every aspect of audio technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and space in the production process.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The flexibility of operating in both synchronous and asynchronous modes allows for compatibility with various systems and applications.

Power Supplies (V): +-5

The wide power supply range of +/-5V provides flexibility in different power supply configurations.

No. of Terminals: 20

Having 20 terminals allows for more versatile connectivity options and functionality.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in challenging environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a common standard in many applications, ensuring easy integration with existing systems.

Technical Specifications

Audio Codecs TP3067WM attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

A-LAW

Filter:

YES

Maximum Gain Tolerance:

.15 dB

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

Length:

12.8015 mm

Linear Coding:

NOT AVAILABLE

Moisture Sensitivity Level (MSL):

4

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

220

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

2.642 mm

Sub-Category:

Codecs

Maximum Supply Current:

.01 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

7.493 mm

Trade Compliance

TP3067WM Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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