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STW5098

STMicroelectronics

STW5098 by STMicroelectronics

STW5098 by STMicroelectronics is a low-profile PCM codec designed for audio applications, featuring a compact 6x6 mm square package. It operates synchronously with a nominal voltage of 1.8 V and supports temperatures from -30 °C to 85°C. With 112 terminals and integrated filtering, it ensures high performance in telecom systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,563 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,563

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-

-

-

Anansix

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Vyrian

USA . 526 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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526

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 536 parts In-Stock

1+ parts

$12.207

100+ parts

-

1k+ parts

$10.986

10k+ parts

-

536

$12.207

-

$10.986

-

MKK Technologies

India . 233 parts In-Stock

1+ parts

$22.954

100+ parts

-

1k+ parts

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10k+ parts

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233

$22.954

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DigiPath Technology Company

USA . 233 parts In-Stock

1+ parts

$22.954

100+ parts

-

1k+ parts

-

10k+ parts

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233

$22.954

-

-

-

Corphita

USA . 3,064 parts In-Stock

1+ parts

-

100+ parts

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3,064

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-

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Parana Technologies

USA . 653 parts In-Stock

1+ parts

-

100+ parts

$14.595

1k+ parts

-

10k+ parts

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653

-

$14.595

-

-

Overview

Unlock superior audio performance with the STW5098 by STMicroelectronics, a trusted leader in innovative semiconductor solutions. Designed for seamless integration in various applications, this compact audio codec delivers exceptional sound quality while ensuring reliability across varying environments. Its low-profile design and robust features empower developers to create cutting-edge audio experiences, enhancing products and captivating users with rich, clear sound. Elevate your audio innovations today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and protection against environmental factors, making this codec suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for efficient use of space and enables high-density placement on PCBs, making it ideal for compact electronic designs.

No. of Functions: 2

With two functions integrated into a single package, this codec reduces the number of components required, simplifying circuit design and reducing costs.

Package Shape: SQUARE

The square package shape optimizes layout on PCB, facilitating easier routing and enhancing design flexibility.

Operating Mode: SYNCHRONOUS

The synchronous operating mode provides precise timing control, which is essential for high-quality audio signal processing.

No. of Terminals: 112

A higher number of terminals allows for more functionality and connectivity options within the same package, supporting advanced audio processing features.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array design contributes to a low profile and fine pitch, enabling higher-density mounting and ideal for modern compact electronic devices.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability and performance in varying thermal environments, making it suitable for demanding applications.

Minimum Operating Temperature: -30 °C

With a minimum operating temperature of -30 °C, this codec can function in extremely cold conditions, adding to its versatility.

Terminal Finish: TIN SILVER COPPER

The tin-silver-copper terminal finish enhances solderability and reliability, contributing to overall device longevity and performance.

Terminal Position: BOTTOM

Bottom-positioned terminals facilitate easier mounting on PCBs and optimize space utilization, ideal for modern circuit designs.

Maximum Seated Height: 1.4 mm

A low maximum seated height enhances compatibility with low-profile designs, allowing for thinner designs without sacrificing component performance.

Width: 6 mm

A compact width of 6 mm makes it suitable for tight spaces in electronic devices, providing flexibility in design.

Length: 6 mm

Similar to its width, a 6 mm length supports compact design requirements, ideal for modern portable devices.

Temperature Grade: COMMERCIAL EXTENDED

This temperature grade indicates the codec is suitable for a range of commercial applications, ensuring stable performance in varying conditions.

Terminal Form: BALL

Ball terminal form is beneficial for reliable mechanical connections and good electrical performance, making it ideal for high-performance applications.

Telecom IC Type: PCM CODEC

Being a PCM codec type, it is well-suited for high-quality audio processing, making it ideal for telecommunications and audio applications.

Nominal Supply Voltage: 1.8 V

A low nominal supply voltage of 1.8 V aids in power efficiency, extending battery life in portable devices and reducing overall power consumption.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for more compact layouts and higher density, supporting advanced designs without sacrificing performance.

Filter: YES

The presence of a filter enhances audio quality by reducing noise and unwanted signals, ensuring clearer sound and better performance.

Technical Specifications

Audio Codecs STW5098 attributes and parameters. Explore more Audio Codecs devices from STMicroelectronics

Specs

Filter:

YES

JESD-30 Code:

S-PBGA-B112

JESD-609 Code:

e1

Length:

6 mm

No. of Functions:

2

No. of Terminals:

112

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

6 mm

Trade Compliance

STW5098 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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