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STW5093CYL

STMicroelectronics

STW5093CYL by STMicroelectronics

STW5093CYL by STMicroelectronics is a compact PCM codec designed for audio applications, featuring a 30-terminal dual gull-wing configuration. It operates in synchronous mode with a nominal voltage of 3V and withstands temperatures from -30 °C to 85 °C. Ideal for telecom devices, it ensures high-quality audio processing with A/MU-LAW companding.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,417 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,417

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-

-

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Digiode

USA . 1,724 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,724

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Anansix

USA . 958 parts In-Stock

1+ parts

-

100+ parts

-

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958

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 332 parts In-Stock

1+ parts

$13.884

100+ parts

-

1k+ parts

$12.495

10k+ parts

-

332

$13.884

-

$12.495

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MKK Technologies

India . 1,741 parts In-Stock

1+ parts

$26.107

100+ parts

-

1k+ parts

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10k+ parts

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1,741

$26.107

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DigiPath Technology Company

USA . 1,741 parts In-Stock

1+ parts

$26.107

100+ parts

-

1k+ parts

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10k+ parts

-

1,741

$26.107

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A-Z Elektronik GmbH

Germany . 4,910 parts In-Stock

1+ parts

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4,910

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Parana Technologies

USA . 1,865 parts In-Stock

1+ parts

-

100+ parts

$16.600

1k+ parts

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10k+ parts

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1,865

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$16.600

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Corphita

USA . 1,604 parts In-Stock

1+ parts

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1,604

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Overview

Experience unparalleled audio quality with the STW5093CYL from STMicroelectronics, a trusted leader in semiconductor innovation. This cutting-edge audio codec combines durability and efficiency, making it perfect for a wide range of applications—from telecommunications to multimedia devices. Its compact design ensures seamless integration while delivering superior performance in extreme temperatures. Elevate your next project with reliable sound precision backed by STMicroelectronics' commitment to excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy in the package body enhances resistance to environmental factors and improves longevity, making it a reliable choice for various applications.

Surface Mount: YES

Surface mount technology allows for easier PCB integration and saves space, making this codec ideal for compact electronic designs.

Package Shape: RECTANGULAR

The rectangular package shape optimizes layout density on the circuit board, maximizing the available space for other components.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for better timing accuracy and reduced latency, which is critical for high-quality audio applications.

No. of Terminals: 30

With 30 terminals, this codec supports a versatile set of functionalities and connectivity options, making it adaptable to complex designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design ensure minimal footprint on the PCB, ideal for space-constrained electronic devices.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature ensures reliability under warm conditions, making this codec suitable for industrial and automotive applications.

Minimum Operating Temperature: -30 °C

The wide temperature range enables operation in extreme environmental conditions, enhancing versatility in various fields.

Terminal Position: DUAL

Dual terminal positioning facilitates efficient signal routing and enhances the ease of integration into the PCB layout.

Maximum Seated Height: 1.1 mm

The low maximum seated height allows for a slim design, encouraging the development of sleek and appealing electronic products.

Width: 4.4 mm

The compact width enables effective layout options, making it easy to incorporate into diverse audio system designs.

Companding Law: A/MU-LAW

Support for A/MU-LAW companding optimizes signal processing for audio codecs, enhancing dynamic range and overall audio quality.

Length: 7.8 mm

A modest length allows for flexibility in design, making the codec suitable for a range of applications from simple audio systems to complex devices.

Temperature Grade: COMMERCIAL EXTENDED

Commercial extended temperature grades ensure robust performance across a variety of operating conditions, enhancing reliability in consumer products.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and better mechanical support, boosting assembly efficiency and device durability.

Telecom IC Type: PCM CODEC

As a PCM codec, this device is optimized for Pulse Code Modulation, ensuring high-fidelity audio processing, essential for telecommunication applications.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3 V allows for power efficiency, making it suitable for battery-powered devices.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm is optimal for high-density mounting, allowing for more compact designs without sacrificing functionality.

Filter: YES

Inclusion of filtering capabilities ensures cleaner audio signals, reducing noise and enhancing overall performance for critical audio applications.

Technical Specifications

Audio Codecs STW5093CYL attributes and parameters. Explore more Audio Codecs devices from STMicroelectronics

Specs

Companding Law:

A/MU-LAW

Filter:

YES

JESD-30 Code:

R-PDSO-G30

Length:

7.8 mm

No. of Functions:

1

No. of Terminals:

30

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

STW5093CYL Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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