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ETC5064N-X

STMicroelectronics

ETC5064N-X by STMicroelectronics

ETC5064N-X by STMicroelectronics is an Audio Codec with +-5V power supplies, 20 terminals, and companding law MU-LAW. It operates in synchronous/asynchronous mode and has a package style of IN-LINE. Ideal for industrial telecom applications due to its PCM CODEC technology and temperature grade of INDUSTRIAL.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,364 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,364

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-

-

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Vyrian

USA . 3,199 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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3,199

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-

-

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Anansix

USA . 1,783 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,783

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,529 parts In-Stock

1+ parts

$9.473

100+ parts

-

1k+ parts

$8.526

10k+ parts

-

1,529

$9.473

-

$8.526

-

MKK Technologies

India . 2,132 parts In-Stock

1+ parts

$17.814

100+ parts

-

1k+ parts

-

10k+ parts

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2,132

$17.814

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DigiPath Technology Company

USA . 2,132 parts In-Stock

1+ parts

$17.814

100+ parts

-

1k+ parts

-

10k+ parts

-

2,132

$17.814

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-

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Corphita

USA . 3,122 parts In-Stock

1+ parts

-

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3,122

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Northwest PG Solutions

USA . 1,884 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,884

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-

-

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Parana Technologies

USA . 165 parts In-Stock

1+ parts

-

100+ parts

$11.327

1k+ parts

-

10k+ parts

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165

-

$11.327

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Native Components

USA . 48 parts In-Stock

1+ parts

-

100+ parts

-

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48

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Overview

Unleash a new world of crystal-clear audio with the ETC5064N-X by STMicroelectronics. Crafted with precision and expertise, this PCM CODEC is designed to elevate your listening experience to new heights. Whether you're a music enthusiast or a professional in the telecom industry, this versatile audio codec offers unmatched value and benefits. With its compact design and industrial-grade temperature tolerance, the ETC5064N-X is the perfect solution for all your audio processing needs. Upgrade your audio game today with STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, suitable for various applications.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The ability to operate in both synchronous and asynchronous modes provides flexibility and compatibility with different systems.

Power Supplies (V): +-5

The wide range of power supply voltage of +-5V ensures compatibility with various power sources.

No. of Terminals: 20

With 20 terminals, the product offers a high level of connectivity and functionality.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliability in extreme conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows the product to function in cold environments.

Companding Law: MU-LAW

The use of MU-law companding law ensures high-quality audio encoding and decoding, essential for telecom applications.

Technology: CMOS

The CMOS technology used in the product offers low power consumption and high noise immunity, ideal for efficient operation.

Maximum Supply Current: 12 mA

With a maximum supply current of 12 mA, the product consumes low power, making it energy-efficient.

Telecom IC Type: PCM CODEC

Being a PCM codec, the product is designed specifically for telecommunications, ensuring high-quality audio transmission and reception.

Filter: YES

The presence of a filter enhances the audio quality by removing unwanted noise and interference.

Technical Specifications

Audio Codecs ETC5064N-X attributes and parameters. Explore more Audio Codecs devices from STMicroelectronics

Specs

Companding Law:

MU-LAW

Filter:

YES

Maximum Gain Tolerance:

.15 dB

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e3

Length:

25.15 mm

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

3.93 mm

Sub-Category:

Codecs

Maximum Supply Current:

12 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

ETC5064N-X Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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