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TP3056BDWR

Texas Instruments

TP3056BDWR by Texas Instruments

TP3056BDWR by Texas Instruments is a PCM CODEC with A/MU-LAW companding law. It operates synchronously at +-5V, with 16 terminals in a small outline package. Ideal for telecom applications, it features a filter and GULL WING terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,725 parts In-Stock

1+ parts

-

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6,725

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Digiode

USA . 3,202 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,202

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Inventory MP

USA . 343 parts In-Stock

1+ parts

-

100+ parts

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343

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Bristol Electronics

USA . 343 parts In-Stock

1+ parts

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343

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,179 parts In-Stock

1+ parts

$10.537

100+ parts

-

1k+ parts

$11.043

10k+ parts

-

2,179

$10.537

-

$11.043

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DigiPath Technology Company

USA . 1,276 parts In-Stock

1+ parts

$11.602

100+ parts

$10.674

1k+ parts

-

10k+ parts

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1,276

$11.602

$10.674

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ChromeModa Solutions

Germany . 3,379 parts In-Stock

1+ parts

$11.839

100+ parts

$9.708

1k+ parts

-

10k+ parts

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3,379

$11.839

$9.708

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IDEA Electronic Components Group

UK . 951 parts In-Stock

1+ parts

$11.839

100+ parts

$11.247

1k+ parts

$10.655

10k+ parts

-

951

$11.839

$11.247

$10.655

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AZTECH Wire

Italy . 683 parts In-Stock

1+ parts

$17.127

100+ parts

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683

$17.127

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One Stop Electronics

USA . 1,308 parts In-Stock

1+ parts

$57.000

100+ parts

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1,308

$57.000

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A-Z Elektronik GmbH

Germany . 6,659 parts In-Stock

1+ parts

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6,659

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Corphita

USA . 2,326 parts In-Stock

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2,326

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Experience crystal-clear audio quality with the TP3056BDWR by Texas Instruments, a leading manufacturer in the industry. Perfect for a wide range of applications in the audio codecs category, this product offers unparalleled value and benefits to customers. With a compact package body material and synchronous operating mode, this PCM CODEC ensures optimal performance and reliability. Trust Texas Instruments to deliver cutting-edge technology that enhances your audio experience like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product easy to handle and transport.

Surface Mount: YES

Surface mount technology allows for easy and efficient integration onto circuit boards.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures accurate and reliable data transmission.

Power Supplies (V): +-5

Support for dual power supplies with +-5 volts enhances flexibility and compatibility with different systems.

Filter: YES

The presence of a filter helps to improve the quality of sound output by reducing noise and interference.

Technical Specifications

Audio Codecs TP3056BDWR attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

A/MU-LAW

Filter:

YES

Maximum Gain Tolerance:

.15 dB

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Linear Coding:

NOT AVAILABLE

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Codecs

Maximum Supply Current:

.009 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

TP3056BDWR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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