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TLV320AC40IDWR

Texas Instruments

TLV320AC40IDWR by Texas Instruments

TLV320AC40IDWR by Texas Instruments is an Audio Codec with 20 terminals, operating at -40 to 85°C. It features companding law μ-law, synchronous/asynchronous mode, and PCM CODEC for telecom applications. The small outline package measures 12.8mm x 7.5mm x 2.65mm and uses CMOS technology for industrial-grade temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,718 parts In-Stock

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4,718

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Digiode

USA . 3,586 parts In-Stock

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3,586

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 589 parts In-Stock

1+ parts

$6.429

100+ parts

-

1k+ parts

$7.177

10k+ parts

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589

$6.429

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$7.177

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ChromeModa Solutions

Germany . 6,321 parts In-Stock

1+ parts

$7.224

100+ parts

$5.924

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6,321

$7.224

$5.924

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IDEA Electronic Components Group

UK . 1,447 parts In-Stock

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$7.224

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$6.502

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1,447

$7.224

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$6.502

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AZTECH Wire

Italy . 444 parts In-Stock

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$7.602

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444

$7.602

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One Stop Electronics

USA . 495 parts In-Stock

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$434.000

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495

$434.000

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Semicontronic

India . 817 parts In-Stock

1+ parts

$543.000

100+ parts

$529.425

1k+ parts

$526.710

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817

$543.000

$529.425

$526.710

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Ampacity Inc.

Singapore . 350 parts In-Stock

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$758.000

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350

$758.000

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Corphita

USA . 3,240 parts In-Stock

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DigiPath Technology Company

USA . 1,068 parts In-Stock

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$6.513

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1,068

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$6.513

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Corohmni

South Africa . 199 parts In-Stock

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Overview

Enhance your audio experience with the TLV320AC40IDWR by Texas Instruments. Known for their high-quality products, Texas Instruments delivers exceptional audio codecs that are perfect for a wide range of applications. Whether you're designing a new sound system or improving an existing setup, this PCM CODEC offers unmatched value and benefits. With a compact design and industrial-grade temperature tolerance, this audio codec ensures reliable performance in any environment. Upgrade your audio solutions today with the TLV320AC40IDWR and enjoy superior sound quality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable audio devices.

Surface Mount: YES

Surface mount capability allows for easier and more efficient assembly on circuit boards.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The ability to operate in both synchronous and asynchronous modes provides flexibility in various audio processing applications.

No. of Terminals: 20

Having 20 terminals allows for multiple connections and functionalities within the audio codec.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and stability even under demanding conditions.

Companding Law: MU-LAW

The use of mu-law companding law ensures efficient signal compression and expansion for high-quality audio transmission.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the codec energy-efficient and reliable.

Nominal Supply Voltage: 3 V

The 3V supply voltage is commonly used in electronic devices, ensuring compatibility and easy integration into various systems.

Filter: YES

The inclusion of a filter helps in refining the audio signal and reducing noise interference, resulting in clear and crisp audio output.

Technical Specifications

Audio Codecs TLV320AC40IDWR attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

MU-LAW

Filter:

YES

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

7.5 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TLV320AC40IDWR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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