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TP3052WM

Texas Instruments

TP3052WM by Texas Instruments

TP3052WM by Texas Instruments is an audio codec with +-5V power supplies, 18 terminals, and mu-law companding law. It is a PCM CODEC suitable for telecom applications due to its small outline package style and commercial temperature grade.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,330 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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8,330

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-

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Digiode

USA . 4,109 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,109

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Anansix

USA . 2,293 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,293

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 544 parts In-Stock

1+ parts

$7.251

100+ parts

-

1k+ parts

-

10k+ parts

-

544

$7.251

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-

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Parana Technologies

USA . 769 parts In-Stock

1+ parts

$8.156

100+ parts

-

1k+ parts

$8.754

10k+ parts

-

769

$8.156

-

$8.754

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DigiPath Technology Company

USA . 131 parts In-Stock

1+ parts

$8.981

100+ parts

$8.262

1k+ parts

-

10k+ parts

-

131

$8.981

$8.262

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IDEA Electronic Components Group

UK . 194 parts In-Stock

1+ parts

$9.164

100+ parts

$8.706

1k+ parts

$8.248

10k+ parts

-

194

$9.164

$8.706

$8.248

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ChromeModa Solutions

Germany . 38 parts In-Stock

1+ parts

$9.164

100+ parts

$7.514

1k+ parts

-

10k+ parts

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38

$9.164

$7.514

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One Stop Electronics

USA . 663 parts In-Stock

1+ parts

$145.000

100+ parts

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663

$145.000

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Corphita

USA . 3,718 parts In-Stock

1+ parts

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3,718

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Overview

Elevate your audio experience with the TP3052WM by Texas Instruments. Known for their exceptional quality and reliability, Texas Instruments delivers cutting-edge technology in the form of this PCM CODEC. Perfect for a wide range of applications, this small outline package offers customers unparalleled value and benefits. Upgrade your audio systems with ease and confidence with the TP3052WM from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable audio devices.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and reducing assembly time.

Power Supplies (V): +-5

The dual power supply of +-5V provides stable and balanced voltage, ensuring optimal performance of the audio codec.

Companding Law: MU-LAW

The use of MU-LAW companding law allows for efficient compression and expansion of audio signals, maintaining high audio quality.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the codec energy-efficient and reliable.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage ensures compatibility with standard power sources, simplifying the design and operation of audio systems.

Filter: YES

The inclusion of a filter helps in reducing noise and improving the clarity of audio signals, enhancing the overall audio experience.

Technical Specifications

Audio Codecs TP3052WM attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

MU-LAW

Filter:

YES

Maximum Gain Tolerance:

.15 dB

JESD-30 Code:

R-PDSO-G18

JESD-609 Code:

e0

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP18,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

+-5

Qualification:

Not Qualified

Sub-Category:

Codecs

Maximum Supply Current:

9 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

TP3052WM Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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