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TP3071J

Texas Instruments

TP3071J by Texas Instruments

TP3071J by Texas Instruments is a synchronous audio codec with 20 terminals in an in-line package style. Operating b/w 0°C to 70°C, it has companding law A/MU-LAW and supports negative supply voltage of -5V. Ideal for telecom applications, this programmable codec features a filter and ceramic, glass-sealed body material.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,140 parts In-Stock

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4,140

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Anansix

USA . 2,735 parts In-Stock

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2,735

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Vyrian

USA . 2,178 parts In-Stock

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2,178

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Electronic Expediters

USA . 4 parts In-Stock

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AZTECH Wire

Italy . 507 parts In-Stock

1+ parts

$7.605

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507

$7.605

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Parana Technologies

USA . 2,367 parts In-Stock

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$8.092

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$8.680

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2,367

$8.092

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$8.680

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DigiPath Technology Company

USA . 1,814 parts In-Stock

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$8.910

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$8.197

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1,814

$8.910

$8.197

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ChromeModa Solutions

Germany . 5,324 parts In-Stock

1+ parts

$9.092

100+ parts

$7.455

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5,324

$9.092

$7.455

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IDEA Electronic Components Group

UK . 2,045 parts In-Stock

1+ parts

$9.092

100+ parts

$8.637

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$8.183

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2,045

$9.092

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$8.183

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One Stop Electronics

USA . 751 parts In-Stock

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$602.000

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751

$602.000

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Corphita

USA . 4,350 parts In-Stock

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4,350

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Perfect Parts

USA . 21 parts In-Stock

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A-Plus Industry Inc.

USA . 2 parts In-Stock

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Overview

Elevate your audio experience with the TP3071J from Texas Instruments, a top-tier manufacturer known for its cutting-edge technology. This programmable codec is a game-changer in the world of audio codecs, offering unparalleled quality and reliability. Perfect for a wide range of applications, this sleek rectangular package boasts a synchronous operating mode and companding law A/MU-LAW, ensuring crystal-clear sound every time. With a commercial temperature grade and dual terminal position, this versatile codec is a must-have for anyone looking to take their audio to the next level. Experience the difference with the TP3071J - where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Operating Mode: SYNCHRONOUS

Synchronous operation helps in maintaining data integrity and precise timing, which is crucial for audio codecs to deliver high-quality sound output.

No. of Terminals: 20

Having a higher number of terminals allows for more connectivity options and functionality in the audio codec.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature indicates that the audio codec can withstand and perform reliably in various environmental conditions.

Nominal Supply Voltage: 5 V

A standard supply voltage makes it compatible with a wide range of systems and devices, offering versatility in application.

Technical Specifications

Audio Codecs TP3071J attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

A/MU-LAW

Filter:

YES

JESD-30 Code:

R-GDIP-T20

Length:

25.019 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Seated Height:

5.08 mm

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TP3071J Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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