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HPA01179IRSBR

Texas Instruments

HPA01179IRSBR by Texas Instruments

Texas Instruments' HPA01179IRSBR is a PCM CODEC with 40 terminals, operating from -40 to 85°C. It features synchronous operation, nickel palladium gold finish, and a compact square chip carrier package. Ideal for audio applications requiring precise signal processing in industrial environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,150 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,150

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-

-

-

Digiode

USA . 1,434 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,434

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 729 parts In-Stock

1+ parts

$11.160

100+ parts

-

1k+ parts

-

10k+ parts

-

729

$11.160

-

-

-

Parana Technologies

USA . 1,615 parts In-Stock

1+ parts

$15.785

100+ parts

-

1k+ parts

$16.145

10k+ parts

-

1,615

$15.785

-

$16.145

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ChromeModa Solutions

Germany . 4,985 parts In-Stock

1+ parts

$17.736

100+ parts

$14.544

1k+ parts

-

10k+ parts

-

4,985

$17.736

$14.544

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IDEA Electronic Components Group

UK . 2,177 parts In-Stock

1+ parts

$17.736

100+ parts

$16.849

1k+ parts

$15.962

10k+ parts

-

2,177

$17.736

$16.849

$15.962

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One Stop Electronics

USA . 384 parts In-Stock

1+ parts

$49.000

100+ parts

-

1k+ parts

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10k+ parts

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384

$49.000

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-

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Corphita

USA . 1,945 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,945

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DigiPath Technology Company

USA . 1,546 parts In-Stock

1+ parts

-

100+ parts

$15.991

1k+ parts

-

10k+ parts

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1,546

-

$15.991

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Overview

Upgrade your audio experience with the HPA01179IRSBR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unmatched quality and reliability in their audio codecs. Perfect for a wide range of applications, this product offers superior sound performance and seamless integration. With its advanced features and cutting-edge technology, the HPA01179IRSBR provides exceptional value and benefits to customers seeking top-notch audio solutions. Elevate your audio projects with this high-quality codec from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the audio codec, ensuring long-lasting performance.

Surface Mount: YES

Easy and convenient installation onto circuit boards, saving time and effort during assembly.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise synchronization of data transfer, reducing errors and improving performance.

Nominal Supply Voltage: 1.8 V

Efficient power usage at a low voltage, making the audio codec environmentally friendly and cost-effective.

Filter: YES

Built-in filter helps to eliminate noise and interference, resulting in clear and high-quality audio output.

Technical Specifications

Audio Codecs HPA01179IRSBR attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Filter:

YES

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

40

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

HPA01179IRSBR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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