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HPA02197IRHBR

Texas Instruments

HPA02197IRHBR by Texas Instruments

Texas Instruments HPA02197IRHBR is a 32-terminal audio codec chip carrier with synchronous operation, suitable for industrial applications. It features 2 channels, operates at -40 to 85°C, and has a nominal voltage of 1.8V. The package style is very thin profile with terminal finish of Ni/Pd/Au for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,145 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,145

-

-

-

-

Digiode

USA . 2,649 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,649

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 559 parts In-Stock

1+ parts

$7.333

100+ parts

-

1k+ parts

-

10k+ parts

-

559

$7.333

-

-

-

Parana Technologies

USA . 1,146 parts In-Stock

1+ parts

$12.721

100+ parts

-

1k+ parts

$13.187

10k+ parts

-

1,146

$12.721

-

$13.187

-

DigiPath Technology Company

USA . 2,210 parts In-Stock

1+ parts

$14.007

100+ parts

$12.887

1k+ parts

-

10k+ parts

-

2,210

$14.007

$12.887

-

-

ChromeModa Solutions

Germany . 6,077 parts In-Stock

1+ parts

$14.293

100+ parts

$11.720

1k+ parts

-

10k+ parts

-

6,077

$14.293

$11.720

-

-

IDEA Electronic Components Group

UK . 1,299 parts In-Stock

1+ parts

$14.293

100+ parts

$13.578

1k+ parts

$12.864

10k+ parts

-

1,299

$14.293

$13.578

$12.864

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One Stop Electronics

USA . 496 parts In-Stock

1+ parts

$421.000

100+ parts

-

1k+ parts

-

10k+ parts

-

496

$421.000

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-

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Corphita

USA . 3,514 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,514

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Overview

Experience superior audio quality with the HPA02197IRHBR by Texas Instruments, a leading manufacturer in the industry. This Audio Codec is perfect for a wide range of applications, offering customers unparalleled value and benefits. Enhance your audio projects with this innovative product that guarantees reliability and efficiency. Trust Texas Instruments to deliver exceptional performance and quality in every aspect of their products.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount design allows for easy installation and compact integration into circuit boards.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures accurate and synchronized data processing, crucial for audio codecs.

No. of Terminals: 32

Having 32 terminals provides sufficient connectivity options for different audio input/output channels.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures without performance degradation, suitable for industrial use.

Nominal Supply Voltage: 1.8 V

Low nominal supply voltage helps in reducing power consumption and extends battery life in portable devices.

Technical Specifications

Audio Codecs HPA02197IRHBR attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Filter:

YES

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

32

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

HPA02197IRHBR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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