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TCM29C26DWR

Texas Instruments

TCM29C26DWR by Texas Instruments

TCM29C26DWR by Texas Instruments is a PCM CODEC with A/MU-LAW companding law. It operates in synchronous/asynchronous mode, has 16 terminals, and supports filter. This small outline package audio codec is ideal for telecom applications with -5V to 5V supply voltage range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,869 parts In-Stock

1+ parts

-

100+ parts

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7,869

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Digiode

USA . 2,743 parts In-Stock

1+ parts

-

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-

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2,743

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 448 parts In-Stock

1+ parts

$13.236

100+ parts

-

1k+ parts

$13.740

10k+ parts

-

448

$13.236

-

$13.740

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DigiPath Technology Company

USA . 1,399 parts In-Stock

1+ parts

$14.575

100+ parts

-

1k+ parts

-

10k+ parts

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1,399

$14.575

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-

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ChromeModa Solutions

Germany . 1,385 parts In-Stock

1+ parts

$14.872

100+ parts

$12.195

1k+ parts

-

10k+ parts

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1,385

$14.872

$12.195

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IDEA Electronic Components Group

UK . 129 parts In-Stock

1+ parts

$14.872

100+ parts

$14.128

1k+ parts

$13.385

10k+ parts

-

129

$14.872

$14.128

$13.385

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AZTECH Wire

Italy . 255 parts In-Stock

1+ parts

$18.135

100+ parts

-

1k+ parts

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255

$18.135

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One Stop Electronics

USA . 918 parts In-Stock

1+ parts

$24.000

100+ parts

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918

$24.000

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Corphita

USA . 1,175 parts In-Stock

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1,175

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Overview

Enhance your audio experience with the TCM29C26DWR by Texas Instruments, a top-of-the-line Audio Codec designed to deliver exceptional sound quality. Manufactured by industry leader Texas Instruments, this compact and versatile device is perfect for a wide range of applications in telecommunications and audio equipment. With its synchronous/asynchronous operating mode and companding law options, this PCM CODEC ensures optimal performance in any setting. Trust Texas Instruments to provide superior technology that exceeds expectations. Elevate your audio solutions with the TCM29C26DWR and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for portable devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing production costs.

Package Shape: RECTANGULAR

The rectangular shape helps in easy placement and alignment on the PCB, optimizing space usage.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

Supports both synchronous and asynchronous operation for flexible compatibility with different systems.

No. of Terminals: 16

Sufficient number of terminals for connection with other components and peripherals in a system.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and allows for compact device designs.

Maximum Operating Temperature: 70 °C

Wide operating temperature range ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

Operates efficiently even at lower temperatures, suitable for both indoor and outdoor applications.

Companding Law: A/MU-LAW

Supports A-law and μ-law companding for high-quality audio signal processing in telecommunications.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures stable performance in standard operating environments.

Nominal Negative Supply Voltage: -5 V

Supports a negative supply voltage for power-efficient operation and signal processing.

Maximum Supply Current: 6 mA

Low supply current consumption for energy-efficient operation and prolonged battery life.

Telecom IC Type: PCM CODEC

Specifically designed for telecommunications applications, ensuring clear and accurate audio transmission.

Nominal Supply Voltage: 5 V

Standard 5V supply voltage for compatibility with common power sources in electronic devices.

Filter: YES

Built-in filter for noise reduction and improved audio quality in signal processing.

Technical Specifications

Audio Codecs TCM29C26DWR attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

A/MU-LAW

Filter:

YES

JESD-30 Code:

R-PDSO-G16

Length:

10.3 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

6 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TCM29C26DWR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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