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TLV320AIC21CPFBG4

Texas Instruments

TLV320AIC21CPFBG4 by Texas Instruments

TLV320AIC21CPFBG4 by Texas Instruments is a 48-terminal audio codec with 2 channels. It operates in synchronous mode, supporting input/output codes in twos complement format. With a max output voltage of 2.35V, it is ideal for telecom applications requiring programmable codecs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,489 parts In-Stock

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8,489

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Digiode

USA . 2,515 parts In-Stock

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2,515

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 763 parts In-Stock

1+ parts

$8.563

100+ parts

$795.176

1k+ parts

$7.706

10k+ parts

-

763

$8.563

$795.176

$7.706

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DigiPath Technology Company

USA . 1,577 parts In-Stock

1+ parts

$9.429

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1,577

$9.429

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ChromeModa Solutions

Germany . 1,555 parts In-Stock

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$9.621

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$7.889

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-

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1,555

$9.621

$7.889

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IDEA Electronic Components Group

UK . 791 parts In-Stock

1+ parts

$9.621

100+ parts

$9.140

1k+ parts

$8.659

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-

791

$9.621

$9.140

$8.659

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AZTECH Wire

Italy . 592 parts In-Stock

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$9.803

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592

$9.803

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One Stop Electronics

USA . 1,198 parts In-Stock

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$345.000

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$345.000

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Corphita

USA . 501 parts In-Stock

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Overview

Experience unparalleled audio quality with the TLV320AIC21CPFBG4 by Texas Instruments, a leading manufacturer known for innovative solutions. This Audio Codec is ideal for a wide range of applications, delivering crystal clear sound and reliable performance. Whether you’re designing consumer electronics, automotive systems, or professional audio equipment, this product offers exceptional value, benefits, and advantages that will elevate your end product to the next level. Trust Texas Instruments to deliver cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Output Code: TWOS COMPLEMENT

Twos complement output code ensures accurate representation of the analog signal with minimal noise and distortion.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and synchronization, essential for audio data processing.

Power Supplies (V): 1.8, 3.3

Support for multiple power supply voltages provides flexibility and compatibility with various system requirements.

No. of Terminals: 48

The high number of terminals enables versatile connectivity options and enhanced functionality.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even under demanding environmental conditions.

Technology: CMOS

The CMOS technology allows for low power consumption and high levels of integration, making the product energy-efficient and compact.

Resolution (um): 16

The high resolution of 16um ensures accurate signal processing and reproduction, resulting in high-quality audio output.

Technical Specifications

Audio Codecs TLV320AIC21CPFBG4 attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 3.3V ANALOG SUPPLY

Maximum Analog Input:

2 V

Filter:

YES

Input Code:

TWOS COMPLEMENT

Input Type:

SINGLE-ENDED/DIFF

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

48

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output (V):

VOLTAGE

Output Code:

TWOS COMPLEMENT

Maximum Output Voltage:

2.35 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Resolution (um):

16

Maximum Seated Height:

1.2 mm

Sub-Category:

Codecs

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TLV320AIC21CPFBG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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