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TLV320AC36IDWR

Texas Instruments

TLV320AC36IDWR by Texas Instruments

TLV320AC36IDWR by Texas Instruments is a 20-terminal audio codec with 13-bit linear coding and companding law MU-LAW. Operating at temperatures from -40 to 85°C, it has a supply voltage of 3V and max current of 7.5mA. Ideal for PCM codec applications in industrial settings due to its compact size and synchronous/asynchronous operation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,083 parts In-Stock

1+ parts

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9,083

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Digiode

USA . 4,580 parts In-Stock

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-

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4,580

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 632 parts In-Stock

1+ parts

$5.657

100+ parts

-

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632

$5.657

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Parana Technologies

USA . 1,193 parts In-Stock

1+ parts

$11.214

100+ parts

-

1k+ parts

$11.652

10k+ parts

-

1,193

$11.214

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$11.652

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DigiPath Technology Company

USA . 1,560 parts In-Stock

1+ parts

$12.348

100+ parts

$11.360

1k+ parts

-

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1,560

$12.348

$11.360

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ChromeModa Solutions

Germany . 6,648 parts In-Stock

1+ parts

$12.600

100+ parts

$10.332

1k+ parts

-

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6,648

$12.600

$10.332

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IDEA Electronic Components Group

UK . 1,928 parts In-Stock

1+ parts

$12.600

100+ parts

$11.970

1k+ parts

$11.340

10k+ parts

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1,928

$12.600

$11.970

$11.340

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One Stop Electronics

USA . 605 parts In-Stock

1+ parts

$604.000

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-

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605

$604.000

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Corphita

USA . 1,972 parts In-Stock

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1,972

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Overview

Experience crystal-clear audio quality like never before with the TLV320AC36IDWR from Texas Instruments. As a leader in audio codecs, Texas Instruments delivers top-notch performance and reliability in every product. Ideal for a wide range of applications, this codec offers seamless functionality and unmatched precision. Elevate your audio experience with the TLV320AC36IDWR, providing exceptional value and benefits to customers looking for top-of-the-line audio solutions. Trust Texas Instruments to bring you the best in audio technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the product, ensuring long-term reliability.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

Offers flexibility in operation, allowing the user to choose the mode that best suits their application requirements.

Power Supplies (V): 3/5

Supports a wide range of power supply voltages, making it versatile and compatible with various systems.

Companding Law: MU-LAW

Mu-law companding provides high-quality compression and expansion of audio signals, ensuring clear and accurate sound reproduction.

Technology: CMOS

CMOS technology offers low power consumption and high integration, making the product energy-efficient and compact in design.

Filter: YES

Includes a built-in filter to remove unwanted noise and interference, resulting in improved audio quality.

Technical Specifications

Audio Codecs TLV320AC36IDWR attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

MU-LAW

Filter:

YES

Maximum Gain Tolerance:

2 dB

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Linear Coding:

13-BIT

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Codecs

Maximum Supply Current:

7.5 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

TLV320AC36IDWR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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