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M5116F1

STMicroelectronics

M5116F1 by STMicroelectronics

STMicroelectronics' M5116F1 is a PCM CODEC with +-5V power supplies, 16 terminals, and 10mA max supply current. Ideal for telecom applications, it operates b/w 0-70 °C with MU-LAW companding law in a ceramic rectangular package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,333 parts In-Stock

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4,333

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Vyrian

USA . 3,852 parts In-Stock

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3,852

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Anansix

USA . 884 parts In-Stock

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884

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Bristol Electronics

USA . 218 parts In-Stock

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218

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Resion

USA . 77 parts In-Stock

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77

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Legend Electronics Inc.

USA . 1 parts In-Stock

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,753 parts In-Stock

1+ parts

$7.292

100+ parts

-

1k+ parts

$6.563

10k+ parts

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1,753

$7.292

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$6.563

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MKK Technologies

India . 397 parts In-Stock

1+ parts

$13.712

100+ parts

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397

$13.712

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DigiPath Technology Company

USA . 397 parts In-Stock

1+ parts

$13.712

100+ parts

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397

$13.712

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Parana Technologies

USA . 1,083 parts In-Stock

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100+ parts

$8.719

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1,083

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$8.719

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Kepictronics

USA . 706 parts In-Stock

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706

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Corphita

USA . 271 parts In-Stock

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271

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Overview

Elevate your audio experience with the M5116F1 from STMicroelectronics. This high-quality Audio Codec is designed to deliver superior sound performance while offering reliability and efficiency. Ideal for a wide range of applications, this product provides customers with exceptional value and benefits. Whether you're looking to enhance your communication devices or improve your entertainment systems, the M5116F1 is the perfect solution to meet your audio needs. Trust STMicroelectronics for cutting-edge technology and unmatched quality in every product they create.

Feature Benefit Bullets

Package Body Material: CERAMIC

The ceramic package provides excellent durability and heat resistance, making the audio codec suitable for a wide range of operating conditions.

Power Supplies (V): +-5

The dual power supply option of +-5V allows for versatile integration into various electronic systems, providing flexibility in power requirements.

No. of Terminals: 16

With 16 terminals, this audio codec offers multiple connectivity options, enabling easy interfacing with other components in an audio system.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70 °C ensures reliable performance even in demanding environmental conditions, making it a dependable choice for industrial applications.

Companding Law: MU-LAW

The use of Mu-law companding law allows for efficient coding and compression of audio signals without significant loss in quality, ensuring clear and accurate audio reproduction.

Technology: CMOS

Utilizing CMOS technology results in low power consumption and high noise immunity, making the audio codec energy-efficient and reliable for extended usage.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V provides stable power to the audio codec, ensuring consistent performance and minimizing the risk of voltage fluctuations affecting audio quality.

Technical Specifications

Audio Codecs M5116F1 attributes and parameters. Explore more Audio Codecs devices from STMicroelectronics

Specs

Companding Law:

MU-LAW

Filter:

NO

Maximum Gain Tolerance:

1.25 dB

JESD-30 Code:

R-XDIP-T16

JESD-609 Code:

e0

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

+-5

Qualification:

Not Qualified

Sub-Category:

Codecs

Maximum Supply Current:

10 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

M5116F1 Telecommunications trade compliance attributes, and parameters.

NSN

5962-01-129-3867, 5962011293867

NIIN

011293867

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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