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TP13064ADWR

Texas Instruments

TP13064ADWR by Texas Instruments

TP13064ADWR by Texas Instruments is a PCM CODEC with companding law MU-LAW. Operating in industrial temperature range (-40 to 85 °C), it has 20 terminals in a small outline package. Suitable for telecom applications, it features synchronous/asynchronous operation and requires -5V/+5V nominal voltage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,073 parts In-Stock

1+ parts

-

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5,073

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Digiode

USA . 65 parts In-Stock

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65

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,870 parts In-Stock

1+ parts

$11.690

100+ parts

-

1k+ parts

$12.081

10k+ parts

-

1,870

$11.690

-

$12.081

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AZTECH Wire

Italy . 453 parts In-Stock

1+ parts

$12.351

100+ parts

-

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453

$12.351

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IDEA Electronic Components Group

UK . 1,901 parts In-Stock

1+ parts

$13.135

100+ parts

$12.478

1k+ parts

$11.822

10k+ parts

-

1,901

$13.135

$12.478

$11.822

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ChromeModa Solutions

Germany . 1,082 parts In-Stock

1+ parts

$13.135

100+ parts

$10.771

1k+ parts

-

10k+ parts

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1,082

$13.135

$10.771

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One Stop Electronics

USA . 1,336 parts In-Stock

1+ parts

$152.000

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1,336

$152.000

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Semicontronic

India . 1,150 parts In-Stock

1+ parts

$209.000

100+ parts

$203.775

1k+ parts

$202.730

10k+ parts

-

1,150

$209.000

$203.775

$202.730

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Ampacity Inc.

Singapore . 341 parts In-Stock

1+ parts

$802.000

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341

$802.000

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Corphita

USA . 3,592 parts In-Stock

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3,592

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DigiPath Technology Company

USA . 2,226 parts In-Stock

1+ parts

-

100+ parts

$11.843

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2,226

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$11.843

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Corohmni

South Africa . 82 parts In-Stock

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82

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Overview

Experience top-notch audio quality with the TP13064ADWR by Texas Instruments, a leading manufacturer in the industry. This audio codec is perfect for a wide range of applications, delivering exceptional performance and reliability. Its compact design and advanced technology make it a valuable asset for any project. Elevate your audio experience with the TP13064ADWR and enjoy the benefits of superior sound quality and seamless operation. Trust Texas Instruments to provide you with the best audio solutions on the market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it easy to handle and resistant to damage.

Surface Mount: YES

Surface mount allows for easy and efficient installation of the product on circuit boards, saving space and making assembly process simpler.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product remains reliable and stable even in harsh operating conditions.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with standard power sources, making it easy to integrate into existing systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, leading to improved performance and efficiency of the product.

Technical Specifications

Audio Codecs TP13064ADWR attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

MU-LAW

Filter:

YES

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

11 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TP13064ADWR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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