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TCM29C23N

Texas Instruments

TCM29C23N by Texas Instruments

TCM29C23N by Texas Instruments is an Audio Codec with +-5V power supplies, 20 terminals, and A/MU-LAW companding law. It operates in synchronous/asynchronous mode and is ideal for PCM CODEC applications in telecom ICs. The package style is IN-LINE with a rectangular shape and PLASTIC/EPOXY material.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,707 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,707

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Vyrian

USA . 3,978 parts In-Stock

1+ parts

-

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1k+ parts

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10k+ parts

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3,978

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,070 parts In-Stock

1+ parts

$11.652

100+ parts

-

1k+ parts

$12.045

10k+ parts

-

1,070

$11.652

-

$12.045

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DigiPath Technology Company

USA . 1,522 parts In-Stock

1+ parts

$12.830

100+ parts

-

1k+ parts

-

10k+ parts

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1,522

$12.830

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ChromeModa Solutions

Germany . 6,383 parts In-Stock

1+ parts

$13.092

100+ parts

$10.735

1k+ parts

-

10k+ parts

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6,383

$13.092

$10.735

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IDEA Electronic Components Group

UK . 1,524 parts In-Stock

1+ parts

$13.092

100+ parts

$12.437

1k+ parts

$11.783

10k+ parts

-

1,524

$13.092

$12.437

$11.783

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AZTECH Wire

Italy . 514 parts In-Stock

1+ parts

$14.933

100+ parts

-

1k+ parts

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514

$14.933

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One Stop Electronics

USA . 1,495 parts In-Stock

1+ parts

$373.000

100+ parts

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1,495

$373.000

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Corphita

USA . 4,173 parts In-Stock

1+ parts

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4,173

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Overview

Experience high-quality audio performance with the TCM29C23N by Texas Instruments, a leading manufacturer in the industry. This versatile audio codec is ideal for a wide range of applications, offering seamless operation in both synchronous and asynchronous modes. With its compact rectangular design and 20 terminals, this codec is perfect for various audio systems. Enjoy the benefits of reliable performance, precise companding law, and a wide temperature range. Trust Texas Instruments to deliver exceptional value and unmatched quality with the TCM29C23N.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the internal components of the codec, making it suitable for long-term use.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

Supports both synchronous and asynchronous operation modes, allowing flexibility in different communication setups.

Power Supplies (V): +-5

Supports a wide range of power supplies (+-5V), ensuring compatibility with various systems.

Package Style (Meter): IN-LINE

In-line package style saves space and provides ease of integration into different electronic devices.

Nominal Negative Supply Voltage: -5 V

Provides a stable negative supply voltage (-5V) for proper functioning of the codec.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency of the codec.

Filter: YES

Inclusion of a filter ensures clean and accurate signal processing, resulting in high-quality audio output.

Technical Specifications

Audio Codecs TCM29C23N attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

A/MU-LAW

Filter:

YES

Maximum Gain Tolerance:

.5 dB

JESD-30 Code:

R-PDIP-T20

Length:

24.325 mm

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Codecs

Maximum Supply Current:

9 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

TCM29C23N Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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