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TP3057V-X

Texas Instruments

TP3057V-X by Texas Instruments

TP3057V-X by Texas Instruments is an Audio Codec with +-5V power supplies, A-LAW companding law, and 20 terminals in a chip carrier package. It operates in synchronous/asynchronous mode and is ideal for PCM codec applications in military-grade telecom ICs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,871 parts In-Stock

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Vyrian

USA . 3,084 parts In-Stock

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Anansix

USA . 1,171 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 453 parts In-Stock

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$5.062

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453

$5.062

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Parana Technologies

USA . 1,789 parts In-Stock

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$15.856

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$16.214

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1,789

$15.856

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$16.214

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DigiPath Technology Company

USA . 301 parts In-Stock

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$17.460

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301

$17.460

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ChromeModa Solutions

Germany . 4,812 parts In-Stock

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$17.816

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$14.609

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4,812

$17.816

$14.609

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IDEA Electronic Components Group

UK . 2,173 parts In-Stock

1+ parts

$17.816

100+ parts

$16.925

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$16.034

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2,173

$17.816

$16.925

$16.034

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One Stop Electronics

USA . 331 parts In-Stock

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$508.000

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331

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Microchip USA

USA . 5,441 parts In-Stock

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Corphita

USA . 4,602 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 4,284 parts In-Stock

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Overview

Unleash the power of audio with the TP3057V-X by Texas Instruments, a top-of-the-line audio codec designed for optimal performance and reliability. As a leading manufacturer in the industry, Texas Instruments ensures that this product delivers unmatched quality and precision. Ideal for a wide range of applications, this codec offers customers exceptional value and benefits, making it the perfect choice for all your audio needs. Experience the difference with the TP3057V-X and elevate your audio experience today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material helps in providing durability and protection to the internals of the audio codec, ensuring a longer lifespan.

Surface Mount: YES

Surface mount feature makes it easy to install and solder onto circuit boards, saving time and effort in the assembly process.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

Support for synchronous and asynchronous operation modes offers flexibility in different applications, providing compatibility with various systems.

Power Supplies (V): +-5

Wide power supply range of +-5V allows the audio codec to work with different voltage levels, making it versatile for use in various devices.

No. of Terminals: 20

Having 20 terminals enables multiple connections for input and output signals, facilitating complex audio processing tasks efficiently.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125°C ensures reliable performance even in demanding environments with elevated temperatures.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the audio codec efficient and reliable in operation.

Technical Specifications

Audio Codecs TP3057V-X attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

A-LAW

Filter:

YES

Maximum Gain Tolerance:

.15 dB

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e0

Length:

8.89 mm

Linear Coding:

NOT AVAILABLE

Moisture Sensitivity Level (MSL):

3

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

220

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Codecs

Maximum Supply Current:

11 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.89 mm

Trade Compliance

TP3057V-X Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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