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TCM29C13N-3N-10

Texas Instruments

TCM29C13N-3N-10 by Texas Instruments

TCM29C13N-3N-10 by Texas Instruments is an Audio Codec with 20 terminals, operating in synchronous/asynchronous mode. It has a package style of IN-LINE and operates at temperatures b/w 0°C to 70°C. This PCM CODEC features companding law A/MU-LAW and is suitable for telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,428 parts In-Stock

1+ parts

-

100+ parts

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6,428

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Digiode

USA . 4,890 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,890

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 445 parts In-Stock

1+ parts

$6.905

100+ parts

-

1k+ parts

$7.510

10k+ parts

-

445

$6.905

-

$7.510

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ChromeModa Solutions

Germany . 753 parts In-Stock

1+ parts

$7.758

100+ parts

$6.362

1k+ parts

-

10k+ parts

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753

$7.758

$6.362

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IDEA Electronic Components Group

UK . 308 parts In-Stock

1+ parts

$7.758

100+ parts

-

1k+ parts

$6.982

10k+ parts

-

308

$7.758

-

$6.982

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AZTECH Wire

Italy . 583 parts In-Stock

1+ parts

$8.168

100+ parts

-

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583

$8.168

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One Stop Electronics

USA . 496 parts In-Stock

1+ parts

$438.000

100+ parts

-

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496

$438.000

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DigiPath Technology Company

USA . 1,813 parts In-Stock

1+ parts

-

100+ parts

$6.995

1k+ parts

-

10k+ parts

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1,813

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$6.995

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Corphita

USA . 88 parts In-Stock

1+ parts

-

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88

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Overview

Experience crystal clear audio quality with the TCM29C13N-3N-10 by Texas Instruments, a leading manufacturer in the industry. This Audio Codec is perfect for a wide range of applications, offering unparalleled value and benefits to customers. Whether you're looking to enhance your communication devices or improve sound quality in your electronics, this product delivers top-notch performance with its advanced features and reliable design. Upgrade your audio experience today with the TCM29C13N-3N-10 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The ability to operate in both synchronous and asynchronous modes offers flexibility in different system configurations.

No. of Terminals: 20

Having 20 terminals allows for a variety of connections and interfaces, increasing the versatility of this product.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product is suitable for a wide range of environments and applications.

Companding Law: A/MU-LAW

The A/MU-Law companding law ensures high-quality audio signal processing, resulting in clear and accurate sound output.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is a common standard in many electronic devices, making this product compatible with a wide range of systems.

Technical Specifications

Audio Codecs TCM29C13N-3N-10 attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

A/MU-LAW

Filter:

YES

JESD-30 Code:

R-PDIP-T20

Length:

24.325 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Current:

9 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TCM29C13N-3N-10 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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