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STW5093CYLT

STMicroelectronics

STW5093CYLT by STMicroelectronics

STW5093CYLT by STMicroelectronics is a compact PCM codec designed for audio applications. It operates in synchronous mode with a supply voltage of 3V and features a temperature range from -30 °C to 85°C. Its small outline package ensures efficient integration in telecom devices.

Median Price

$5.000

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TEDSS.com

USA . 4,528 parts In-Stock

1+ parts

$5.000

100+ parts

$4.290

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4,528

$5.000

$4.290

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 11,204 parts In-Stock

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Vyrian

USA . 4,233 parts In-Stock

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4,233

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Digiode

USA . 3,658 parts In-Stock

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3,658

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Anansix

USA . 1,120 parts In-Stock

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1,120

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Cyclops Electronics Ltd

UK . 934 parts In-Stock

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934

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,723 parts In-Stock

1+ parts

$12.653

100+ parts

-

1k+ parts

$11.387

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1,723

$12.653

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$11.387

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MKK Technologies

India . 1,059 parts In-Stock

1+ parts

$23.793

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1,059

$23.793

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DigiPath Technology Company

USA . 1,059 parts In-Stock

1+ parts

$23.793

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1,059

$23.793

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Authorized Procurement Solutions

USA . 115,500 parts In-Stock

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115,500

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Assy Fe

Spain . 9,556 parts In-Stock

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Kepictronics

USA . 8,000 parts In-Stock

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8,000

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Corphita

USA . 3,878 parts In-Stock

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3,878

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A-Z Elektronik GmbH

Germany . 2,867 parts In-Stock

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2,867

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Parana Technologies

USA . 1,316 parts In-Stock

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$15.128

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1,316

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$15.128

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Overview

Elevate your audio experience with the STW5093CYLT from STMicroelectronics, a leader in innovation and quality. This advanced audio codec promises superior sound reproduction and seamless integration into various applications, from telecommunications to consumer electronics. With its compact design and reliable performance across a wide temperature range, you can trust it to deliver exceptional value and efficiency, empowering your projects to reach new heights in audio clarity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures lightweight design while providing adequate protection and durability for the components inside.

Surface Mount: YES

Surface mount technology allows for a more compact and efficient design, enabling easier integration into modern circuit boards.

Package Shape: RECTANGULAR

Rectangular package shape facilitates efficient use of board space and allows for efficient heat dissipation.

Operating Mode: SYNCHRONOUS

Synchronous operation can lead to improved performance and lower latency, making it suitable for real-time audio applications.

No. of Terminals: 30

A higher number of terminals provides greater connectivity options, allowing for complex functionality in audio processing.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This compact package style is ideal for space-constrained applications, making it versatile for various designs.

Maximum Operating Temperature: 85 °C

Operational stability up to 85 °C ensures reliability in various environments, making it suitable for consumer and industrial applications.

Minimum Operating Temperature: -30 °C

The ability to function at -30 °C broadens the range of applications in extreme environments, ensuring adaptability.

Terminal Position: DUAL

Dual terminal positioning allows for easier soldering and placement on PCB, enhancing manufacturability.

Maximum Seated Height: 1.1 mm

A low seated height contributes to low-profile designs, which is crucial for modern compact electronic devices.

Width: 4.4 mm

A narrow width allows for efficient space utilization on circuit boards, especially in dense layouts.

Companding Law: A/MU-LAW

Utilizing A/MU-LAW companding law optimizes audio compression, enhancing voice quality and reducing bandwidth in digital communication.

Length: 7.8 mm

The length is suited for compact designs, ensuring the codec can fit into a variety of audio products.

Temperature Grade: COMMERCIAL EXTENDED

Designed to withstand a wide temperature range, making it reliable for long-term use in diverse conditions.

Terminal Form: GULL WING

Gull wing terminal form is favorable for automated soldering processes, supporting high-yield manufacturing.

Telecom IC Type: PCM CODEC

As a PCM codec, it delivers high-quality digital audio processing, essential for telecommunications and high-fidelity audio applications.

Nominal Supply Voltage: 3 V

Operating at a low supply voltage of 3 V makes this codec energy-efficient, extending battery life in portable devices.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for denser array placements, facilitating advanced circuit designs.

Filter: YES

Inclusion of filters improves signal integrity and reduces noise, making it a reliable choice for quality audio applications.

Technical Specifications

Audio Codecs STW5093CYLT attributes and parameters. Explore more Audio Codecs devices from STMicroelectronics

Specs

Companding Law:

A/MU-LAW

Filter:

YES

JESD-30 Code:

R-PDSO-G30

Length:

7.8 mm

No. of Functions:

1

No. of Terminals:

30

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

STW5093CYLT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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