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TCM320AC54N

Texas Instruments

TCM320AC54N by Texas Instruments

TCM320AC54N by Texas Instruments is an Audio Codec with +-5V power supplies, 16 terminals, and mu-law companding law. It operates synchronously in commercial temperature grade applications like PCM codecs for telecom ICs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,781 parts In-Stock

1+ parts

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4,781

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Digiode

USA . 1,721 parts In-Stock

1+ parts

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1,721

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,910 parts In-Stock

1+ parts

$11.333

100+ parts

-

1k+ parts

$11.763

10k+ parts

-

1,910

$11.333

-

$11.763

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DigiPath Technology Company

USA . 1,917 parts In-Stock

1+ parts

$12.479

100+ parts

-

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1,917

$12.479

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IDEA Electronic Components Group

UK . 1,938 parts In-Stock

1+ parts

$12.734

100+ parts

$12.097

1k+ parts

$11.461

10k+ parts

-

1,938

$12.734

$12.097

$11.461

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ChromeModa Solutions

Germany . 584 parts In-Stock

1+ parts

$12.734

100+ parts

$10.442

1k+ parts

-

10k+ parts

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584

$12.734

$10.442

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AZTECH Wire

Italy . 833 parts In-Stock

1+ parts

$17.544

100+ parts

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833

$17.544

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One Stop Electronics

USA . 356 parts In-Stock

1+ parts

$190.000

100+ parts

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356

$190.000

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Corphita

USA . 2,995 parts In-Stock

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2,995

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Overview

Upgrade your audio experience with the TCM320AC54N from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-quality products that guarantee superior performance and reliability. Ideal for a wide range of applications in the audio codecs category, this product offers customers unmatched value, benefits, and advantages. Enhance your projects with ease and precision using the TCM320AC54N and enjoy crystal-clear sound like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and lightweight, making the product suitable for portable devices.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures accurate and synchronized data transfer, improving the overall performance of the codec.

Power Supplies (V): +-5

Wide power supply range allows for flexibility in different applications and environments.

No. of Terminals: 16

Sufficient number of terminals for connectivity and functionality in a compact design.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliable performance in various conditions.

Filter: YES

Inclusion of a filter helps in noise reduction and signal clarity, enhancing the audio quality.

Technical Specifications

Audio Codecs TCM320AC54N attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

MU-LAW

Filter:

YES

Maximum Gain Tolerance:

1.5 dB

JESD-30 Code:

R-PDIP-T16

Length:

19.305 mm

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Codecs

Maximum Supply Current:

.011 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

TCM320AC54N Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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