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TLV320AC36IN

Texas Instruments

TLV320AC36IN by Texas Instruments

TLV320AC36IN by Texas Instruments is a 20-terminal PCM CODEC with 13-bit linear coding and mu-law companding. Operating at 3/5V, it has synchronous/asynchronous modes and operates in industrial temperature range. Ideal for telecom applications, this rectangular package codec features a filter and consumes up to 7.5mA supply current.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,592 parts In-Stock

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4,592

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Digiode

USA . 1,656 parts In-Stock

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1,656

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 644 parts In-Stock

1+ parts

$11.224

100+ parts

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644

$11.224

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Parana Technologies

USA . 281 parts In-Stock

1+ parts

$15.692

100+ parts

-

1k+ parts

$16.061

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281

$15.692

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$16.061

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DigiPath Technology Company

USA . 933 parts In-Stock

1+ parts

$17.278

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933

$17.278

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ChromeModa Solutions

Germany . 6,441 parts In-Stock

1+ parts

$17.631

100+ parts

$14.457

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6,441

$17.631

$14.457

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IDEA Electronic Components Group

UK . 1,844 parts In-Stock

1+ parts

$17.631

100+ parts

$16.749

1k+ parts

$15.868

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1,844

$17.631

$16.749

$15.868

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One Stop Electronics

USA . 1,558 parts In-Stock

1+ parts

$839.000

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1,558

$839.000

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Corphita

USA . 4,340 parts In-Stock

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4,340

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Overview

Experience crystal-clear audio like never before with the TLV320AC36IN by Texas Instruments. As a leading manufacturer in audio codecs, Texas Instruments delivers top-notch quality and reliability in every product. Perfect for a wide range of applications, this PCM codec offers unparalleled value, benefits, and advantages to customers. Upgrade your audio experience today with the TLV320AC36IN and enjoy superior sound quality in industrial-grade environments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The ability to operate in both synchronous and asynchronous modes provides flexibility in integration with different systems and devices.

Power Supplies (V): 3/5

Support for multiple power supply options (3V and 5V) allows for compatibility with different power sources and systems.

No. of Terminals: 20

Having 20 terminals provides ample connectivity options for interfacing with other components and devices.

Linear Coding: 13-BIT

The 13-bit linear coding ensures high-resolution audio encoding and decoding for superior sound quality.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature range (-40 to 85°C) allows for reliable operation in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Filter: YES

The presence of a filter helps in enhancing audio quality by reducing noise and distortion in the signal.

Technical Specifications

Audio Codecs TLV320AC36IN attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

MU-LAW

Filter:

YES

Maximum Gain Tolerance:

2 dB

JESD-30 Code:

R-PDIP-T20

Length:

24.325 mm

Linear Coding:

13-BIT

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Codecs

Maximum Supply Current:

7.5 mA

Nominal Supply Voltage:

3 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

TLV320AC36IN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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