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TP3057V/63SN

Texas Instruments

TP3057V/63SN by Texas Instruments

PCM CODEC; JESD-609 Code: e3; Terminal Finish: MATTE TIN; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 250; Maximum Time At Peak Reflow Temperature (s): 30;

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,718 parts In-Stock

1+ parts

-

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1k+ parts

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8,718

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Digiode

USA . 993 parts In-Stock

1+ parts

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993

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,189 parts In-Stock

1+ parts

$11.910

100+ parts

-

1k+ parts

$12.309

10k+ parts

-

1,189

$11.910

-

$12.309

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DigiPath Technology Company

USA . 2,291 parts In-Stock

1+ parts

$13.114

100+ parts

$12.065

1k+ parts

-

10k+ parts

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2,291

$13.114

$12.065

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ChromeModa Solutions

Germany . 2,729 parts In-Stock

1+ parts

$13.382

100+ parts

$10.973

1k+ parts

-

10k+ parts

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2,729

$13.382

$10.973

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IDEA Electronic Components Group

UK . 789 parts In-Stock

1+ parts

$13.382

100+ parts

$12.713

1k+ parts

$12.044

10k+ parts

-

789

$13.382

$12.713

$12.044

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AZTECH Wire

Italy . 442 parts In-Stock

1+ parts

$18.247

100+ parts

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442

$18.247

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One Stop Electronics

USA . 1,428 parts In-Stock

1+ parts

$246.000

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1,428

$246.000

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QUARKTWIN TECHNOLOGY LTD

USA . 29,307 parts In-Stock

1+ parts

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29,307

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Microchip USA

USA . 7,191 parts In-Stock

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7,191

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Corphita

USA . 2,193 parts In-Stock

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2,193

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Technical Specifications

Audio Codecs TP3057V/63SN attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

250

Telecom IC Type:

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

TP3057V/63SN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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