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TCM29C16AN

Texas Instruments

TCM29C16AN by Texas Instruments

Texas Instruments TCM29C16AN is a PCM CODEC with +-5V power supplies, 16 terminals, and MU-LAW companding law. It operates in synchronous/asynchronous mode for audio applications. Package style: IN-LINE, dimensions: 19.305mm x 7.62mm x 5.08mm (LxWxH), suitable for telecom systems with filter feature at commercial temperature grade of 0-70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,841 parts In-Stock

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4,841

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Digiode

USA . 1,931 parts In-Stock

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-

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1,931

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MISTER SPROCKETS

USA . 250 parts In-Stock

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250

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Bristol Electronics

USA . 12 parts In-Stock

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12

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 280 parts In-Stock

1+ parts

$6.545

100+ parts

-

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280

$6.545

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Parana Technologies

USA . 1,077 parts In-Stock

1+ parts

$8.923

100+ parts

-

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$9.594

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1,077

$8.923

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$9.594

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DigiPath Technology Company

USA . 2,036 parts In-Stock

1+ parts

$9.825

100+ parts

$9.039

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2,036

$9.825

$9.039

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IDEA Electronic Components Group

UK . 2,037 parts In-Stock

1+ parts

$10.026

100+ parts

$9.525

1k+ parts

$9.023

10k+ parts

-

2,037

$10.026

$9.525

$9.023

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ChromeModa Solutions

Germany . 504 parts In-Stock

1+ parts

$10.026

100+ parts

$8.221

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504

$10.026

$8.221

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One Stop Electronics

USA . 329 parts In-Stock

1+ parts

$399.000

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329

$399.000

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Corphita

USA . 4,014 parts In-Stock

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4,014

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Kepictronics

USA . 413 parts In-Stock

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413

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Overview

Upgrade your audio experience with the TCM29C16AN from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This audio codec is perfect for a wide range of applications, offering seamless operation in both synchronous and asynchronous modes. With its compact design and exceptional performance, this product provides unmatched value and benefits to customers seeking high-quality audio solutions. Say goodbye to mediocre sound quality and elevate your audio experience with the TCM29C16AN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and reliability, making the product suitable for long-term use.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The ability to operate in both synchronous and asynchronous modes allows for flexibility in different system configurations.

Power Supplies (V): +-5

Support for dual power supplies at +-5V ensures stable and consistent performance.

Package Style (Meter): IN-LINE

The in-line package style is convenient for installation and integration in various setups.

Companding Law: MU-LAW

Mu-law companding provides high-quality audio compression, ensuring clear and accurate sound reproduction.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures compatibility with standard operating conditions in commercial applications.

Technology: CMOS

CMOS technology offers low power consumption and high integration, making the product efficient and cost-effective.

Telecom IC Type: PCM CODEC

Being a PCM codec specifically designed for telecom applications, this product performs optimally in voice communication systems.

Filter: YES

The inclusion of a filter enhances signal processing and noise reduction, improving overall audio quality.

Technical Specifications

Audio Codecs TCM29C16AN attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

MU-LAW

Filter:

YES

Maximum Gain Tolerance:

.08 dB

JESD-30 Code:

R-PDIP-T16

Length:

19.305 mm

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Codecs

Maximum Supply Current:

9 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

TCM29C16AN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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