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TP3057BFN

Texas Instruments

TP3057BFN by Texas Instruments

TP3057BFN by Texas Instruments is a PCM CODEC with A-LAW companding law. It operates in synchronous/asynchronous mode, has 20 terminals, and supports filter. This audio codec is used in telecom applications for encoding/decoding signals with -5V/+5V supply voltage range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,589 parts In-Stock

1+ parts

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3,589

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Digiode

USA . 405 parts In-Stock

1+ parts

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405

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 455 parts In-Stock

1+ parts

$10.006

100+ parts

-

1k+ parts

$10.568

10k+ parts

-

455

$10.006

-

$10.568

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IDEA Electronic Components Group

UK . 273 parts In-Stock

1+ parts

$11.243

100+ parts

$10.681

1k+ parts

$10.119

10k+ parts

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273

$11.243

$10.681

$10.119

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ChromeModa Solutions

Germany . 64 parts In-Stock

1+ parts

$11.243

100+ parts

$9.219

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-

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64

$11.243

$9.219

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AZTECH Wire

Italy . 567 parts In-Stock

1+ parts

$14.319

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567

$14.319

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One Stop Electronics

USA . 616 parts In-Stock

1+ parts

$811.000

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616

$811.000

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Corphita

USA . 4,312 parts In-Stock

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4,312

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DigiPath Technology Company

USA . 1,768 parts In-Stock

1+ parts

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100+ parts

$10.137

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1,768

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$10.137

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Overview

Upgrade your audio experience with the TP3057BFN by Texas Instruments, a top-of-the-line PCM CODEC designed for crystal clear sound performance. Manufactured with precision and expertise, this Audio Codec offers seamless synchronous/asynchronous operation in a compact square chip carrier package. Whether you're looking to enhance your telecom systems or improve your audio processing applications, this high-quality product delivers unmatched value and reliability. Trust Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product easy to handle and transport.

Surface Mount: YES

Being surface mountable allows for easy integration into circuit boards, saving space and simplifying assembly.

Package Shape: SQUARE

The square shape of the package makes it easy to mount and align on circuit boards, ensuring a secure fit.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The ability to operate in both synchronous and asynchronous modes provides flexibility in different system configurations.

No. of Terminals: 20

Having 20 terminals allows for versatile connectivity options and compatibility with a range of systems.

Package Style (Meter): CHIP CARRIER

The chip carrier package style is compact and efficient, ideal for space-constrained designs.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures makes this product suitable for a wide range of applications.

Terminal Position: QUAD

The quad terminal position allows for easy connections and secure attachment to the circuit board.

Maximum Seated Height: 4.57 mm

The low seated height of the package conserves space on the circuit board and allows for compact designs.

Width: 8.9662 mm

The narrow width of the product enables efficient use of space on the circuit board.

Companding Law: A-LAW

A-Law companding law provides high-quality audio compression and decompression, ensuring clear and accurate sound reproduction.

Length: 8.9662 mm

The compact length of the product contributes to its overall space-saving design.

Temperature Grade: COMMERCIAL

This commercial-grade product is suitable for a wide range of commercial applications where reliability and performance are essential.

Nominal Negative Supply Voltage: -5 V

Having a negative supply voltage of -5V allows for efficient power management and compatibility with various systems.

Terminal Form: J BEND

The J bend terminal form simplifies the process of soldering and ensures secure connections to the circuit board.

Maximum Supply Current: 9 mA

With a maximum supply current of 9mA, this product operates efficiently and conserves energy.

Telecom IC Type: PCM CODEC

Being a PCM codec telecom IC type, this product is specifically designed for high-quality audio encoding and decoding in telecommunication applications.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V ensures stable and reliable operation of the product.

Terminal Pitch: 1.27 mm

The narrow terminal pitch of 1.27mm allows for precise connections and efficient use of space on the circuit board.

Filter: YES

The inclusion of a filter ensures that only desired frequencies are passed through, improving the overall audio quality of the product.

Technical Specifications

Audio Codecs TP3057BFN attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

A-LAW

Filter:

YES

JESD-30 Code:

S-PQCC-J20

Length:

8.9662 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Current:

9 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.9662 mm

Trade Compliance

TP3057BFN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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