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TCM129C17J

Texas Instruments

TCM129C17J by Texas Instruments

TCM129C17J by Texas Instruments is an Audio Codec with A-LAW companding law, operating at +-5V. It features 16 terminals in a rectangular package style for synchronous/asynchronous operation. Ideal for telecom applications, it has a max operating temperature of 85°C and min of -40°C.

Median Price

$15.000

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ace Electronics

USA . 45 parts In-Stock

1+ parts

$15.000

100+ parts

-

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45

$15.000

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Vyrian

USA . 4,975 parts In-Stock

1+ parts

-

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-

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4,975

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Digiode

USA . 1,047 parts In-Stock

1+ parts

-

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1,047

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LWI Electronics Inc

India . 47 parts In-Stock

1+ parts

-

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47

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 503 parts In-Stock

1+ parts

$8.843

100+ parts

-

1k+ parts

$9.531

10k+ parts

-

503

$8.843

-

$9.531

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IDEA Electronic Components Group

UK . 1,104 parts In-Stock

1+ parts

$9.936

100+ parts

$9.439

1k+ parts

$8.942

10k+ parts

-

1,104

$9.936

$9.439

$8.942

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ChromeModa Solutions

Germany . 409 parts In-Stock

1+ parts

$9.936

100+ parts

$8.148

1k+ parts

-

10k+ parts

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409

$9.936

$8.148

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AZTECH Wire

Italy . 555 parts In-Stock

1+ parts

$14.997

100+ parts

-

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555

$14.997

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One Stop Electronics

USA . 1,557 parts In-Stock

1+ parts

$79.000

100+ parts

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1,557

$79.000

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Corphita

USA . 3,734 parts In-Stock

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3,734

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DigiPath Technology Company

USA . 941 parts In-Stock

1+ parts

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100+ parts

$8.958

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941

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$8.958

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Overview

Experience the unparalleled quality and reliability of Texas Instruments with the TCM129C17J audio codec. Designed to meet the demands of industrial applications, this PCM codec offers seamless synchronous/asynchronous operation with a companding law for crystal-clear audio quality. With a compact in-line package and wide operating temperature range, this versatile codec provides exceptional value and performance for your audio processing needs. Trust Texas Instruments for cutting-edge technology and superior products that deliver exceptional results every time.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material ensures durability and reliability in various operating conditions.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

Support for both synchronous and asynchronous operating modes makes this audio codec versatile and compatible with different systems.

Power Supplies (V): +-5

The dual power supply option of +-5V allows for flexible power input, catering to a wide range of applications.

Package Style (Meter): IN-LINE

The in-line package style offers easy handling and integration into PCB layouts.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this audio codec can withstand harsh environmental conditions typically encountered in industrial settings.

Technology: CMOS

CMOS technology ensures low power consumption and high performance, making this audio codec energy-efficient and reliable.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage provides stable power delivery for consistent performance.

Filter: YES

Having a built-in filter enhances audio quality by reducing noise and interference, resulting in clear and crisp sound output.

Technical Specifications

Audio Codecs TCM129C17J attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

A-LAW

Filter:

YES

Maximum Gain Tolerance:

.08 dB

JESD-30 Code:

R-GDIP-T16

Length:

19.56 mm

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Codecs

Maximum Supply Current:

13 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

TCM129C17J Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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