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TLV320AIC21CPFBRG4

Texas Instruments

TLV320AIC21CPFBRG4 by Texas Instruments

TLV320AIC21CPFBRG4 by Texas Instruments is a 48-terminal audio codec with 2 channels. It operates at temperatures from 0 to 70°C, with power supplies of 1.8V and 3.3V. Ideal for telecom applications, it features two's complement output/input codes and a CMOS technology design.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,476 parts In-Stock

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Digiode

USA . 2,315 parts In-Stock

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2,315

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,002 parts In-Stock

1+ parts

$8.561

100+ parts

-

1k+ parts

$9.220

10k+ parts

-

1,002

$8.561

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$9.220

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DigiPath Technology Company

USA . 2,303 parts In-Stock

1+ parts

$9.427

100+ parts

$8.672

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-

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2,303

$9.427

$8.672

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ChromeModa Solutions

Germany . 4,233 parts In-Stock

1+ parts

$9.619

100+ parts

$7.888

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4,233

$9.619

$7.888

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IDEA Electronic Components Group

UK . 1,245 parts In-Stock

1+ parts

$9.619

100+ parts

$9.138

1k+ parts

$8.657

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1,245

$9.619

$9.138

$8.657

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AZTECH Wire

Italy . 211 parts In-Stock

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$10.181

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211

$10.181

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Ampacity Inc.

Singapore . 1,645 parts In-Stock

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$359.000

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1,645

$359.000

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Semicontronic

India . 703 parts In-Stock

1+ parts

$722.000

100+ parts

$703.950

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$700.340

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703

$722.000

$703.950

$700.340

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One Stop Electronics

USA . 653 parts In-Stock

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$841.000

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653

$841.000

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Corphita

USA . 2,526 parts In-Stock

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2,526

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Corohmni

South Africa . 80 parts In-Stock

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Overview

Experience superior audio quality with the TLV320AIC21CPFBRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch Audio Codecs that cater to a wide range of applications. This versatile product ensures clear and crisp sound output with its advanced features. Whether you're designing consumer electronics, automotive audio systems, or professional recording equipment, this codec offers unmatched value and performance. Elevate your audio experience with the TLV320AIC21CPFBRG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials make the package lightweight and durable, ensuring long-lasting performance.

Surface Mount: YES

Surface mount technology allows for easy and secure installation on PCBs, saving space and facilitating mass production.

Output Code: TWOS COMPLEMENT

Two's complement encoding provides accurate and efficient representation of audio data, improving overall sound quality.

Package Shape: SQUARE

Square package shape allows for easy integration into circuit layouts and reduces wasted space.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures consistent and precise data transmission, reducing the risk of errors or distortions in audio playback.

Power Supplies (V): 1.8,3.3

Multiple power supply options offer flexibility in design and compatibility with a wide range of electronic devices.

No. of Terminals: 48

48 terminals provide ample connectivity options for various input and output configurations, allowing for versatile applications.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliable performance even under demanding environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for use in a wide range of climates and environments without performance issues.

Maximum Output Voltage: 2.35 V

High maximum output voltage ensures strong and clear audio signals, enhancing the listening experience.

Maximum Seated Height: 1.2 mm

Low seated height minimizes the overall profile of the product, making it suitable for compact electronic devices.

Width: 7 mm

Narrow width enables easy integration into tight spaces within electronic circuits, maximizing PCB real estate.

Maximum Analog Input: 2 V

High maximum analog input level accommodates a wide range of audio signals without distortion, ensuring accurate sound reproduction.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for reliable soldering processes during manufacturing, ensuring secure connections.

No. of Channels: 2

Dual-channel configuration enables stereo audio processing, providing immersive sound experiences to users.

Technology: CMOS

CMOS technology offers low power consumption and high-speed performance, making the product energy-efficient and responsive.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage ensures consistent operation and reliable performance of the product.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for precise connections on PCBs, reducing the risk of short circuits and ensuring signal integrity.

Resolution (um): 16

High resolution provides detailed audio processing capabilities, enhancing the quality and clarity of sound output.

Input Type: SINGLE-ENDED/DIFF

Support for both single-ended and differential inputs allows for versatile connectivity options, catering to various audio sources.

Filter: YES

Built-in filter enhances audio quality by reducing noise and interference, delivering cleaner and more accurate sound output.

Technical Specifications

Audio Codecs TLV320AIC21CPFBRG4 attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 3.3V ANALOG SUPPLY

Maximum Analog Input:

2 V

Filter:

YES

Input Code:

TWOS COMPLEMENT

Input Type:

SINGLE-ENDED/DIFF

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

48

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output (V):

VOLTAGE

Output Code:

TWOS COMPLEMENT

Maximum Output Voltage:

2.35 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Resolution (um):

16

Maximum Seated Height:

1.2 mm

Sub-Category:

Codecs

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TLV320AIC21CPFBRG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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