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TCM129C17DW

Texas Instruments

TCM129C17DW by Texas Instruments

TCM129C17DW by Texas Instruments is an Audio Codec with A-LAW companding law, operating at -40 to 85 °C. It features a small outline package style, synchronous mode, and +-5V power supplies. Ideal for PCM CODEC applications in industrial temperature grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,247 parts In-Stock

1+ parts

-

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6,247

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Digiode

USA . 3,565 parts In-Stock

1+ parts

-

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-

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3,565

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 424 parts In-Stock

1+ parts

$5.161

100+ parts

-

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424

$5.161

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Parana Technologies

USA . 1,965 parts In-Stock

1+ parts

$15.550

100+ parts

-

1k+ parts

$15.925

10k+ parts

-

1,965

$15.550

-

$15.925

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DigiPath Technology Company

USA . 1,758 parts In-Stock

1+ parts

$17.123

100+ parts

-

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1,758

$17.123

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ChromeModa Solutions

Germany . 2,568 parts In-Stock

1+ parts

$17.472

100+ parts

$14.327

1k+ parts

-

10k+ parts

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2,568

$17.472

$14.327

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IDEA Electronic Components Group

UK . 367 parts In-Stock

1+ parts

$17.472

100+ parts

$16.598

1k+ parts

$15.725

10k+ parts

-

367

$17.472

$16.598

$15.725

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One Stop Electronics

USA . 686 parts In-Stock

1+ parts

$604.000

100+ parts

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686

$604.000

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Corphita

USA . 1,140 parts In-Stock

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1,140

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Overview

Experience unparalleled audio quality with the TCM129C17DW by Texas Instruments, a leading manufacturer in the industry. This Audio Codec offers exceptional performance for a wide range of applications, providing customers with superior sound reproduction and reliability. Its compact design and advanced technology make it the perfect choice for industrial-grade telecom systems, ensuring seamless communication and enhanced user experience. Trust in Texas Instruments to deliver top-notch products that exceed expectations and elevate your audio solutions to new heights. Choose the TCM129C17DW for unmatched value and unbeatable performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and ideal for electronic components, providing protection and longevity to the codec.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise timing and data integrity, essential for audio processing.

Power Supplies (V): +-5

The wide voltage range allows for compatibility with various power sources, increasing flexibility in usage.

No. of Terminals: 16

Sufficient terminals for connectivity and data transfer, enabling the codec to handle multiple input/output channels efficiently.

Temperature Grade: INDUSTRIAL

Suitable for industrial environments with a wide temperature range, ensuring reliable performance in diverse operating conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the codec energy-efficient and reliable in signal processing.

Maximum Supply Current: 13 mA

Low supply current requirement results in minimal power consumption, contributing to energy efficiency and cost-effectiveness.

Telecom IC Type: PCM CODEC

Specifically designed for telecom applications, providing high-quality voice transmission and reception in communication systems.

Filter: YES

Inclusion of a filter helps in signal conditioning, noise reduction, and improving overall audio quality in the codec.

Technical Specifications

Audio Codecs TCM129C17DW attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

A-LAW

Filter:

YES

Maximum Gain Tolerance:

.08 dB

JESD-30 Code:

R-PDSO-G16

Length:

10.3 mm

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Codecs

Maximum Supply Current:

13 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

TCM129C17DW Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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