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TLV320AIC15IDBTG4

Texas Instruments

TLV320AIC15IDBTG4 by Texas Instruments

TLV320AIC15IDBTG4 by Texas Instruments is a 2-channel audio codec with 16um resolution, operating at industrial temperature grade. It features two's complement input/output codes and supports single-ended/differential input types. Ideal for telecom applications, this CMOS technology device has a small outline package with a max seated height of 1.2mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,362 parts In-Stock

1+ parts

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8,362

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Digiode

USA . 4,387 parts In-Stock

1+ parts

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4,387

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,385 parts In-Stock

1+ parts

$9.726

100+ parts

-

1k+ parts

$10.307

10k+ parts

-

1,385

$9.726

-

$10.307

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DigiPath Technology Company

USA . 1,309 parts In-Stock

1+ parts

$10.709

100+ parts

$9.853

1k+ parts

-

10k+ parts

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1,309

$10.709

$9.853

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IDEA Electronic Components Group

UK . 2,330 parts In-Stock

1+ parts

$10.928

100+ parts

$10.382

1k+ parts

$9.835

10k+ parts

-

2,330

$10.928

$10.382

$9.835

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ChromeModa Solutions

Germany . 2,320 parts In-Stock

1+ parts

$10.928

100+ parts

$8.961

1k+ parts

-

10k+ parts

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2,320

$10.928

$8.961

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AZTECH Wire

Italy . 861 parts In-Stock

1+ parts

$15.039

100+ parts

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861

$15.039

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One Stop Electronics

USA . 1,556 parts In-Stock

1+ parts

$307.000

100+ parts

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1,556

$307.000

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Corphita

USA . 4,639 parts In-Stock

1+ parts

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4,639

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Microchip USA

USA . 1,381 parts In-Stock

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1,381

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Overview

Experience unparalleled audio quality with the TLV320AIC15IDBTG4 by Texas Instruments, a leading manufacturer in the industry. This high-performance Audio Codec is perfect for a wide range of applications, offering customers top-notch sound reproduction and seamless integration. Elevate your audio experience with this innovative product that delivers exceptional value, benefits, and advantages to users. Unlock the potential of your audio projects with the TLV320AIC15IDBTG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it easy to handle and transport.

Output Code: TWOS COMPLEMENT

The twos complement output code ensures accurate representation of audio signals, leading to high-quality sound output.

Operating Mode: SYNCHRONOUS

The synchronous operating mode allows for precise synchronization of data transmission, resulting in efficient audio processing.

Power Supplies (V): 1.8,3.3

The availability of multiple power supply options provides flexibility in system design and compatibility with different power sources.

No. of Channels: 2

Having two channels allows for stereo audio conversion, enabling the product to handle multiple audio streams simultaneously.

Resolution (um): 16

With a resolution of 16 um, the product can accurately convert analog audio signals to digital format with high precision.

Technical Specifications

Audio Codecs TLV320AIC15IDBTG4 attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 3.3V ANALOG SUPPLY

Maximum Analog Input:

2 V

Filter:

YES

Input Code:

TWOS COMPLEMENT

Input Type:

SINGLE-ENDED/DIFF

JESD-30 Code:

R-PDSO-G30

JESD-609 Code:

e4

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

30

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

VOLTAGE

Output Code:

TWOS COMPLEMENT

Maximum Output Voltage:

2.35 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP30,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Resolution (um):

16

Maximum Seated Height:

1.2 mm

Sub-Category:

Codecs

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

TLV320AIC15IDBTG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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