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TLV320AIC3106IGQE

Texas Instruments

TLV320AIC3106IGQE by Texas Instruments

TLV320AIC3106IGQE by Texas Instruments is an 80-terminal audio codec with synchronous operation. It features a package style of grid array, very thin profile, and fine pitch. Ideal for industrial applications requiring PCM codec with nominal voltage of 1.8V.

Median Price

$4.820

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 44 parts In-Stock

1+ parts

-

100+ parts

$4.820

1k+ parts

$4.310

10k+ parts

$4.060

44

-

$4.820

$4.310

$4.060

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,630 parts In-Stock

1+ parts

$5.082

100+ parts

-

1k+ parts

-

10k+ parts

-

4,630

$5.082

-

-

-

Vyrian

USA . 8,153 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,153

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,672 parts In-Stock

1+ parts

$4.815

100+ parts

-

1k+ parts

-

10k+ parts

-

1,672

$4.815

-

-

-

Component Stockers USA

USA . 62 parts In-Stock

1+ parts

$5.480

100+ parts

-

1k+ parts

-

10k+ parts

-

62

$5.480

-

-

-

Parana Technologies

USA . 2,309 parts In-Stock

1+ parts

$5.902

100+ parts

$548.052

1k+ parts

$5.311

10k+ parts

-

2,309

$5.902

$548.052

$5.311

-

DigiPath Technology Company

USA . 774 parts In-Stock

1+ parts

$6.498

100+ parts

-

1k+ parts

-

10k+ parts

-

774

$6.498

-

-

-

ChromeModa Solutions

Germany . 2,486 parts In-Stock

1+ parts

$6.631

100+ parts

$5.437

1k+ parts

-

10k+ parts

-

2,486

$6.631

$5.437

-

-

IDEA Electronic Components Group

UK . 2,297 parts In-Stock

1+ parts

$6.631

100+ parts

-

1k+ parts

$5.968

10k+ parts

-

2,297

$6.631

-

$5.968

-

Microchip USA

USA . 2,262 parts In-Stock

1+ parts

$14.392

100+ parts

-

1k+ parts

-

10k+ parts

-

2,262

$14.392

-

-

-

Overview

Elevate your audio experience with the TLV320AIC3106IGQE by Texas Instruments, a top-of-the-line Audio Codec that delivers unparalleled sound quality and precision. As a trusted manufacturer in the industry, Texas Instruments ensures reliability and innovation in every product they create. Perfect for a variety of applications, this codec offers crystal-clear audio performance that will take your projects to the next level. Experience the value and benefits of this exceptional product, providing customers with unbeatable advantages in their audio solutions. Elevate your sound quality with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Allows for easy installation onto circuit boards, saving time and effort during assembly.

Operating Mode: SYNCHRONOUS

Ensures that signals are processed and transmitted in synchronization, reducing errors and improving overall performance.

No. of Terminals: 80

Provides ample connectivity options for different components, allowing for versatile usage.

Maximum Operating Temperature: 85 °C

Can withstand higher temperatures, ensuring reliability even in harsh operating conditions.

Nominal Supply Voltage: 1.8 V

Operates efficiently at low voltage, reducing power consumption and increasing energy efficiency.

Technical Specifications

Audio Codecs TLV320AIC3106IGQE attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 3.3V ANALOG SUPPLY

Filter:

YES

JESD-30 Code:

S-PBGA-B80

JESD-609 Code:

e0

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

80

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

5 mm

Trade Compliance

TLV320AIC3106IGQE Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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