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TCM29C18N-10

Texas Instruments

TCM29C18N-10 by Texas Instruments

Texas Instruments TCM29C18N-10 is a PCM CODEC with MU-LAW companding law. Operating in synchronous mode, it has 16 terminals in an IN-LINE package style. With -5V negative supply voltage and 5V nominal voltage, it's ideal for telecom applications requiring audio codecs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,555 parts In-Stock

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Digiode

USA . 2,694 parts In-Stock

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2,694

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Distributors (Availability)

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AZTECH Wire

Italy . 581 parts In-Stock

1+ parts

$11.142

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581

$11.142

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Parana Technologies

USA . 1,079 parts In-Stock

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$13.175

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$13.680

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$13.680

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DigiPath Technology Company

USA . 1,122 parts In-Stock

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$14.507

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$14.507

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ChromeModa Solutions

Germany . 6,815 parts In-Stock

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$14.803

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$12.138

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6,815

$14.803

$12.138

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IDEA Electronic Components Group

UK . 1,134 parts In-Stock

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$14.803

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$14.063

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$13.323

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$14.803

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One Stop Electronics

USA . 1,183 parts In-Stock

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$285.000

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Corphita

USA . 2,056 parts In-Stock

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Overview

Enhance your audio systems with the top-notch quality of the TCM29C18N-10 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures reliability and performance in every product they create. The TCM29C18N-10 falls under the category of Audio Codecs, making it perfect for applications requiring exceptional sound quality. This product offers customers unparalleled value and benefits, with features like companding law, synchronous operating mode, and a wide temperature range. Elevate your audio experience with the TCM29C18N-10 and enjoy superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the audio codec, ensuring longevity and reliability in various operating conditions.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and synchronization, which is essential for high-quality audio processing and output.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options for interfacing with other components and systems, making it versatile and adaptable.

Max Operating Temperature: 70 °C

The high maximum operating temperature ensures the audio codec can perform optimally even in hot environments, increasing its overall reliability.

Min Operating Temperature: 0 °C

The low minimum operating temperature allows the audio codec to function effectively in cold conditions, making it suitable for a wide range of applications.

Companding Law: MU-LAW

The use of Mu-Law companding law helps in maximizing dynamic range and minimizing quantization errors, resulting in improved audio quality and clarity.

Nominal Supply Voltage: 5 V

A 5V supply voltage is standard and commonly available, making it easy to power the audio codec in a variety of setups and configurations.

Technical Specifications

Audio Codecs TCM29C18N-10 attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

MU-LAW

Filter:

YES

JESD-30 Code:

R-PDIP-T16

Length:

19.305 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Current:

10 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TCM29C18N-10 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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