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TLV320AIC1110GQE

Texas Instruments

TLV320AIC1110GQE by Texas Instruments

TLV320AIC1110GQE by Texas Instruments is a 15-bit audio codec with companding law A/MU-LAW. Operating at 3V, it features synchronous mode and very thin profile grid array package. Ideal for telecom applications requiring PCM encoding/decoding in industrial temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,379 parts In-Stock

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8,379

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Digiode

USA . 637 parts In-Stock

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637

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Distributors (Availability)

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AZTECH Wire

Italy . 887 parts In-Stock

1+ parts

$9.203

100+ parts

-

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887

$9.203

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Parana Technologies

USA . 1,575 parts In-Stock

1+ parts

$10.833

100+ parts

-

1k+ parts

$11.312

10k+ parts

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1,575

$10.833

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$11.312

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ChromeModa Solutions

Germany . 6,923 parts In-Stock

1+ parts

$12.172

100+ parts

$9.981

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6,923

$12.172

$9.981

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IDEA Electronic Components Group

UK . 1,226 parts In-Stock

1+ parts

$12.172

100+ parts

$11.563

1k+ parts

$10.955

10k+ parts

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1,226

$12.172

$11.563

$10.955

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One Stop Electronics

USA . 1,513 parts In-Stock

1+ parts

$739.000

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1,513

$739.000

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DigiPath Technology Company

USA . 676 parts In-Stock

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$10.974

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676

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$10.974

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Corphita

USA . 105 parts In-Stock

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105

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Overview

Experience crystal clear audio quality with the TLV320AIC1110GQE by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments has developed this innovative Audio Codec to deliver exceptional sound performance for a wide range of applications. From telecommunications to consumer electronics, this product offers unmatched value and benefits to customers seeking top-notch audio solutions. Upgrade your audio experience today with the TLV320AIC1110GQE and immerse yourself in high-quality sound like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable audio devices.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving space and improving overall product reliability.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise timing and synchronization, leading to high-quality audio output.

Power Supplies (V): 3

Operates on a standard 3V power supply, making it compatible with a wide range of electronic devices.

No. of Terminals: 80

With 80 terminals, this codec offers versatile connectivity options for various audio input and output channels.

Temperature Grade: INDUSTRIAL

Designed to withstand a wide temperature range, making it suitable for industrial applications where temperature fluctuations are common.

Technology: CMOS

CMOS technology ensures low power consumption and high performance, making the codec energy-efficient and reliable.

Nominal Supply Voltage: 3 V

Operating at a nominal voltage of 3V ensures compatibility with standard power sources, making it easy to integrate into electronic systems.

Technical Specifications

Audio Codecs TLV320AIC1110GQE attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

A/MU-LAW

Filter:

YES

Maximum Gain Tolerance:

1.2 dB

JESD-30 Code:

S-PBGA-B80

Length:

5 mm

Linear Coding:

15-BIT

No. of Functions:

1

No. of Terminals:

80

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA80,9X9,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Codecs

Maximum Supply Current:

.006 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

5 mm

Trade Compliance

TLV320AIC1110GQE Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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