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TCM129C19DWR

Texas Instruments

TCM129C19DWR by Texas Instruments

TCM129C19DWR by Texas Instruments is an Audio Codec with 16 terminals, operating in synchronous/asynchronous mode. It features a companding law of MU-LAW and operates at industrial temperature grade. This PCM CODEC has a supply voltage of 5V, max current of 14mA, and is suitable for telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,728 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,728

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-

-

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Vyrian

USA . 2,139 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,139

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,203 parts In-Stock

1+ parts

$9.177

100+ parts

$852.204

1k+ parts

$8.259

10k+ parts

-

2,203

$9.177

$852.204

$8.259

-

DigiPath Technology Company

USA . 367 parts In-Stock

1+ parts

$10.105

100+ parts

-

1k+ parts

-

10k+ parts

-

367

$10.105

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-

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ChromeModa Solutions

Germany . 5,731 parts In-Stock

1+ parts

$10.311

100+ parts

$8.455

1k+ parts

-

10k+ parts

-

5,731

$10.311

$8.455

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-

IDEA Electronic Components Group

UK . 2,177 parts In-Stock

1+ parts

$10.311

100+ parts

$9.795

1k+ parts

$9.280

10k+ parts

-

2,177

$10.311

$9.795

$9.280

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AZTECH Wire

Italy . 410 parts In-Stock

1+ parts

$15.938

100+ parts

-

1k+ parts

-

10k+ parts

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410

$15.938

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One Stop Electronics

USA . 334 parts In-Stock

1+ parts

$827.000

100+ parts

-

1k+ parts

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10k+ parts

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334

$827.000

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Corphita

USA . 4,750 parts In-Stock

1+ parts

-

100+ parts

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4,750

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Overview

Experience crystal-clear audio quality like never before with the TCM129C19DWR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch Audio Codecs that are versatile and reliable. This PCM CODEC is perfect for a wide range of applications, ensuring seamless communication in both synchronous and asynchronous operating modes. With a compact design and industrial-grade temperature rating, this codec offers exceptional value and performance. Upgrade your audio systems today with the TCM129C19DWR and enjoy unparalleled sound clarity and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for internal components, making the product long-lasting and reliable.

Surface Mount: YES

Allows for easy installation onto circuit boards, saving time and effort during assembly.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

Offers flexibility in how the product can be used in different systems and applications.

Nominal Supply Voltage: 5 V

Standard voltage requirement that is commonly found in electronic devices, ensuring compatibility with various systems.

Technology: CMOS

Utilizes CMOS technology which is known for low power consumption and high noise immunity, enhancing the overall performance of the product.

Technical Specifications

Audio Codecs TCM129C19DWR attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

MU-LAW

Filter:

YES

JESD-30 Code:

R-PDSO-G16

Length:

10.3 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

14 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TCM129C19DWR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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