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TLV320AC36IPTR

Texas Instruments

TLV320AC36IPTR by Texas Instruments

TLV320AC36IPTR by Texas Instruments is a 48-terminal audio codec with 13-bit linear coding and companding law μ-law. Operating at temperatures from -40 to 85°C, it features synchronous/asynchronous modes and consumes a max of 7.5mA at 3-5V. Ideal for telecom applications requiring PCM encoding/decoding in a compact flatpack design.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,597 parts In-Stock

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4,597

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Netsource Technology, Inc.

USA . 918 parts In-Stock

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Digiode

USA . 374 parts In-Stock

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374

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Distributors (Availability)

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Parana Technologies

USA . 2,356 parts In-Stock

1+ parts

$5.652

100+ parts

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$6.448

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$5.652

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$6.448

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DigiPath Technology Company

USA . 1,482 parts In-Stock

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$6.224

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$6.224

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ChromeModa Solutions

Germany . 4,531 parts In-Stock

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$6.351

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$5.208

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4,531

$6.351

$5.208

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IDEA Electronic Components Group

UK . 145 parts In-Stock

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$6.351

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$5.716

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145

$6.351

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$5.716

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AZTECH Wire

Italy . 717 parts In-Stock

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$19.790

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717

$19.790

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One Stop Electronics

USA . 1,477 parts In-Stock

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$344.000

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1,477

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Ampacity Inc.

Singapore . 706 parts In-Stock

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$626.000

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706

$626.000

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A-Z Elektronik GmbH

Germany . 6,197 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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GreenTree Electronics

Israel . 3,430 parts In-Stock

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Kepictronics

USA . 2,150 parts In-Stock

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Infinite Electronics LLP (Excess)

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Assy Fe

Spain . 1,000 parts In-Stock

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Corphita

USA . 585 parts In-Stock

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585

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Overview

Experience unparalleled audio quality with the TLV320AC36IPTR by Texas Instruments. As a leader in audio codecs, Texas Instruments delivers top-notch performance and reliability. Ideal for a wide range of applications, this product offers customers exceptional value and benefits. Take your audio projects to the next level with the TLV320AC36IPTR and enjoy the advantages it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable audio devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and reducing manufacturing costs.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

The ability to operate in both synchronous and asynchronous modes provides flexibility in different system configurations.

Power Supplies (V): 3/5

Support for multiple power supply voltages allows compatibility with a variety of devices and power sources.

No. of Terminals: 48

Having a high number of terminals enables connectivity with multiple components, increasing the versatility of the product.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in challenging environmental conditions.

Companding Law: MU-LAW

The MU-LAW companding law helps in optimizing dynamic range and signal-to-noise ratio, improving audio quality.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Technical Specifications

Audio Codecs TLV320AC36IPTR attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

MU-LAW

Filter:

YES

Maximum Gain Tolerance:

2 dB

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Linear Coding:

13-BIT

No. of Functions:

1

No. of Terminals:

48

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Codecs

Maximum Supply Current:

7.5 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

TLV320AC36IPTR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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