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M5914B1

STMicroelectronics

M5914B1 by STMicroelectronics

STMicroelectronics M5914B1 is an Audio Codec with +-5V power supplies, 24 terminals, and A/MU-LAW companding law. It operates b/w 0-70 °C and has a max supply current of 0.01mA. Ideal for PCM CODEC applications in telecom due to its filter feature and CMOS technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,191 parts In-Stock

1+ parts

-

100+ parts

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1,191

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Digiode

USA . 979 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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979

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Vyrian

USA . 426 parts In-Stock

1+ parts

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100+ parts

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426

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 876 parts In-Stock

1+ parts

$15.168

100+ parts

-

1k+ parts

$13.651

10k+ parts

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876

$15.168

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$13.651

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MKK Technologies

India . 1,182 parts In-Stock

1+ parts

$28.523

100+ parts

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1,182

$28.523

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DigiPath Technology Company

USA . 1,182 parts In-Stock

1+ parts

$28.523

100+ parts

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1,182

$28.523

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Corphita

USA . 3,708 parts In-Stock

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3,708

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Parana Technologies

USA . 2,214 parts In-Stock

1+ parts

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100+ parts

$18.136

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2,214

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$18.136

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Overview

Elevate your audio experience with the M5914B1 from STMicroelectronics, a leading manufacturer known for its high-quality products. This PCM CODEC is packed with features that deliver crystal-clear sound and reliable performance. Whether you're designing a communication system, audio equipment, or any other application in need of top-notch audio processing, this codec is the perfect choice. With its commercial-grade temperature tolerance and dual terminal position, you can trust this product to meet your needs with ease. Upgrade your audio solutions today with the M5914B1 and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration and installation in different electronic devices.

Power Supplies (V): +-5

The dual power supplies of +-5V provide sufficient power for the codec to operate effectively and ensure stable performance.

No. of Terminals: 24

Having 24 terminals allows for versatile connectivity options and interface possibilities with other components in the system.

Package Style (Meter): IN-LINE

The in-line package style offers a compact design, making it space-efficient and suitable for applications where space is limited.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70 °C ensures reliable performance even in harsh operating conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0 °C allows for use in a wide range of environments without compromising performance.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good conductivity and solderability, ensuring a reliable connection and signal transmission.

Terminal Position: DUAL

The dual terminal position allows for flexible mounting and connectivity options, making the codec adaptable to different system configurations.

Companding Law: A/MU-LAW

The A/MU-LAW companding law provides efficient compression and expansion of audio signals, resulting in better audio quality and dynamic range.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures stable performance in standard operating conditions, making the codec suitable for commercial applications.

Technology: CMOS

The CMOS technology used in the codec consumes low power, offers high speed, and is cost-effective, making it an efficient choice for various applications.

Nominal Negative Supply Voltage: -5 V

The nominal negative supply voltage of -5V ensures proper biasing and operation of the codec, contributing to its overall performance and reliability.

Terminal Form: THROUGH-HOLE

The through-hole terminal form allows for easy and secure mounting on PCBs, ensuring a reliable connection and mechanical stability.

Maximum Supply Current: 0.01 mA

The low maximum supply current of 0.01mA results in efficient power consumption, making the codec energy-efficient and suitable for battery-operated devices.

Telecom IC Type: PCM CODEC

Being a PCM codec, the product is designed specifically for telecom applications, ensuring accurate and high-quality encoding and decoding of voice signals.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V provides sufficient power for the codec to operate within its specified performance parameters, ensuring reliable functionality.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54mm allows for easy integration and soldering onto PCBs, facilitating the assembly process and ensuring a reliable connection.

Maximum Gain Tolerance: 0.125 dB

The low maximum gain tolerance of 0.125dB ensures accurate and consistent amplification of audio signals, resulting in clear and distortion-free sound output.

Filter: YES

The inclusion of a filter helps in reducing noise and interference, improving the overall audio quality and providing a cleaner output signal.

Technical Specifications

Audio Codecs M5914B1 attributes and parameters. Explore more Audio Codecs devices from STMicroelectronics

Specs

Companding Law:

A/MU-LAW

Filter:

YES

Maximum Gain Tolerance:

.125 dB

JESD-30 Code:

R-PDIP-T24

JESD-609 Code:

e0

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

+-5

Qualification:

Not Qualified

Sub-Category:

Codecs

Maximum Supply Current:

.01 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

M5914B1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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