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TLV320AD16PZ

Texas Instruments

TLV320AD16PZ by Texas Instruments

TLV320AD16PZ by Texas Instruments is an Audio Codec with 100 terminals, operating at 3.3V. It features synchronous mode, ADSL CODEC type for telecom applications, and a temperature range of -40 to 85°C. Ideal for audio processing in industrial settings due to its compact flatpack design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,122 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,122

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-

-

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Digiode

USA . 4,448 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,448

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 198 parts In-Stock

1+ parts

$6.240

100+ parts

-

1k+ parts

-

10k+ parts

-

198

$6.240

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-

-

Parana Technologies

USA . 2,103 parts In-Stock

1+ parts

$13.103

100+ parts

$1,216.856

1k+ parts

$11.793

10k+ parts

-

2,103

$13.103

$1,216.856

$11.793

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DigiPath Technology Company

USA . 2,129 parts In-Stock

1+ parts

$14.429

100+ parts

-

1k+ parts

-

10k+ parts

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2,129

$14.429

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-

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ChromeModa Solutions

Germany . 6,488 parts In-Stock

1+ parts

$14.723

100+ parts

$12.073

1k+ parts

-

10k+ parts

-

6,488

$14.723

$12.073

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-

IDEA Electronic Components Group

UK . 2,000 parts In-Stock

1+ parts

$14.723

100+ parts

$13.987

1k+ parts

$13.251

10k+ parts

-

2,000

$14.723

$13.987

$13.251

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One Stop Electronics

USA . 1,112 parts In-Stock

1+ parts

$265.000

100+ parts

-

1k+ parts

-

10k+ parts

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1,112

$265.000

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-

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Corphita

USA . 4,710 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,710

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Overview

Elevate your audio experience with the TLV320AD16PZ by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This Audio Codec is perfect for a wide range of applications, providing unparalleled sound performance. With its advanced features and compact design, the TLV320AD16PZ offers exceptional value and benefits to customers. Upgrade your audio systems today with this innovative product and enjoy the advantages it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability, making this audio codec suitable for long-term use.

Surface Mount: YES

Being surface mountable makes installation easier and more convenient, saving time and effort during assembly.

Operating Mode: SYNCHRONOUS

Synchronous operation helps in achieving precise timing and synchronization, improving overall performance and efficiency.

Power Supplies (V): 3.3

Operating at 3.3V allows for compatibility with a wide range of systems and applications, offering flexibility in power supply options.

No. of Terminals: 100

With a high number of terminals, this audio codec can support a variety of connections and functions, making it versatile and adaptable to different setups.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in varying environmental conditions, making this product suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in cold environments, expanding the range of potential use cases for this audio codec.

Telecom IC Type: ADSL CODEC

Being designed as an ADSL CODEC enables this product to handle high-speed data transmission over telecom networks, making it ideal for telecommunications applications.

Technical Specifications

Audio Codecs TLV320AD16PZ attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Filter:

YES

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of Functions:

1

No. of Terminals:

100

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Trade Compliance

TLV320AD16PZ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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