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TCM2917J-00

Texas Instruments

TCM2917J-00 by Texas Instruments

TCM2917J-00 by Texas Instruments is a PCM CODEC with A-LAW companding law. It operates synchronously at temperatures from 0 to 70°C, with -5V negative and 5V nominal voltages. This audio codec has 16 terminals in an inline package style, making it ideal for telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,636 parts In-Stock

1+ parts

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8,636

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Digiode

USA . 943 parts In-Stock

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943

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,965 parts In-Stock

1+ parts

$6.913

100+ parts

-

1k+ parts

$7.515

10k+ parts

-

1,965

$6.913

-

$7.515

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DigiPath Technology Company

USA . 2,141 parts In-Stock

1+ parts

$7.612

100+ parts

-

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2,141

$7.612

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IDEA Electronic Components Group

UK . 966 parts In-Stock

1+ parts

$7.767

100+ parts

-

1k+ parts

$6.990

10k+ parts

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966

$7.767

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$6.990

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ChromeModa Solutions

Germany . 78 parts In-Stock

1+ parts

$7.767

100+ parts

$6.369

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-

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78

$7.767

$6.369

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AZTECH Wire

Italy . 782 parts In-Stock

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$8.071

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782

$8.071

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One Stop Electronics

USA . 1,443 parts In-Stock

1+ parts

$634.000

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1,443

$634.000

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Corphita

USA . 2,736 parts In-Stock

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2,736

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Overview

Unlock the power of crystal-clear audio with the TCM2917J-00 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability in their audio codecs. Perfect for a wide range of applications, this PCM codec offers seamless operation in synchronous mode with A-Law companding law. With a compact package style and wide temperature range, the TCM2917J-00 provides exceptional value and benefits to customers looking for high-performance audio solutions. Elevate your audio experience with Texas Instruments today!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and coordination of data transmission, resulting in reliable and accurate audio encoding and decoding.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this codec can perform efficiently even in demanding environmental conditions without overheating.

Nominal Negative Supply Voltage: -5 V

Having a negative supply voltage option allows for versatility in power supply configurations, enabling compatibility with a wider range of systems.

Technical Specifications

Audio Codecs TCM2917J-00 attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Companding Law:

A-LAW

Filter:

YES

JESD-30 Code:

R-GDIP-T16

Length:

19.56 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

16

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Current:

24 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TCM2917J-00 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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