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TCM37C15N

Texas Instruments

TCM37C15N by Texas Instruments

TCM37C15N by Texas Instruments is an Audio Codec with A-LAW companding law. Operating at +-5V, it has 20 terminals in a rectangular package style. Ideal for PCM CODEC applications in telecom, this CMOS technology device operates from 0 to 70°C temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,578 parts In-Stock

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9,578

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Digiode

USA . 934 parts In-Stock

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934

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Distributors (Availability)

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Parana Technologies

USA . 1,263 parts In-Stock

1+ parts

$9.836

100+ parts

-

1k+ parts

$10.405

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1,263

$9.836

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$10.405

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DigiPath Technology Company

USA . 704 parts In-Stock

1+ parts

$10.831

100+ parts

$9.964

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-

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704

$10.831

$9.964

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ChromeModa Solutions

Germany . 3,389 parts In-Stock

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$11.052

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$9.063

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3,389

$11.052

$9.063

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IDEA Electronic Components Group

UK . 1,146 parts In-Stock

1+ parts

$11.052

100+ parts

$10.499

1k+ parts

$9.947

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1,146

$11.052

$10.499

$9.947

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AZTECH Wire

Italy . 466 parts In-Stock

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$18.747

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466

$18.747

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Semicontronic

India . 348 parts In-Stock

1+ parts

$505.000

100+ parts

$492.375

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$489.850

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348

$505.000

$492.375

$489.850

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Ampacity Inc.

Singapore . 701 parts In-Stock

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$950.000

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701

$950.000

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One Stop Electronics

USA . 777 parts In-Stock

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$987.000

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777

$987.000

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Corphita

USA . 3,089 parts In-Stock

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3,089

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Corohmni

South Africa . 429 parts In-Stock

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Overview

Upgrade your audio experience with the TCM37C15N by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality audio codecs that are perfect for a wide range of applications. Whether you're designing telecommunications equipment or audio processing systems, this PCM CODEC offers exceptional performance and reliability. With a compact design and easy-to-use features, the TCM37C15N provides value and benefits that will exceed your expectations. Experience superior sound quality and seamless operation with this innovative product from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the audio codec, ensuring a longer lifespan for the product.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and synchronization of data transmission, resulting in high-quality audio output.

Power Supplies (V): +-5

Dual power supplies of +-5V provide stable and reliable power to the audio codec, ensuring consistent performance even in varying voltage conditions.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this audio codec can function efficiently even in high-temperature environments.

Companding Law: A-LAW

A-Law companding law helps in achieving high signal-to-noise ratio, reducing quantization noise in the audio codec and delivering clear audio output.

Technology: CMOS

CMOS technology offers low power consumption and high integration capabilities, making this audio codec energy-efficient and compact in design.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V ensures compatibility with standard power sources, making this audio codec easy to integrate into existing setups.

Filter: YES

The presence of a filter helps in improving the signal quality by reducing noise and interference, resulting in cleaner audio output from this codec.

Technical Specifications

Audio Codecs TCM37C15N attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

A-LAW

Filter:

YES

Maximum Gain Tolerance:

.2 dB

JESD-30 Code:

R-PDIP-T20

Length:

24.325 mm

Linear Coding:

NOT AVAILABLE

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

20

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Codecs

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

TCM37C15N Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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