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TLV320AC41CPT

Texas Instruments

TLV320AC41CPT by Texas Instruments

TLV320AC41CPT by Texas Instruments is a 48-terminal audio codec with 13-bit linear coding and A-Law companding law. Operating at 3V, it has synchronous/asynchronous modes and supports PCM codec for telecom applications. The flatpack, low profile package is ideal for commercial temperature grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,246 parts In-Stock

1+ parts

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7,246

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Digiode

USA . 3,544 parts In-Stock

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3,544

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 720 parts In-Stock

1+ parts

$11.937

100+ parts

-

1k+ parts

$12.343

10k+ parts

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720

$11.937

-

$12.343

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ChromeModa Solutions

Germany . 4,583 parts In-Stock

1+ parts

$13.412

100+ parts

$10.998

1k+ parts

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4,583

$13.412

$10.998

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IDEA Electronic Components Group

UK . 2,199 parts In-Stock

1+ parts

$13.412

100+ parts

$12.741

1k+ parts

$12.071

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2,199

$13.412

$12.741

$12.071

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AZTECH Wire

Italy . 634 parts In-Stock

1+ parts

$17.761

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634

$17.761

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One Stop Electronics

USA . 127 parts In-Stock

1+ parts

$642.000

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127

$642.000

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Corphita

USA . 799 parts In-Stock

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799

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DigiPath Technology Company

USA . 677 parts In-Stock

1+ parts

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$12.092

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677

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$12.092

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Overview

Enhance your audio systems with the TLV320AC41CPT from Texas Instruments, a leading manufacturer known for top-quality products. This Audio Codec is perfect for a wide range of applications, offering unmatched value and benefits to customers. With its advanced features and reliable performance, this codec ensures crystal-clear sound quality and seamless operation. Upgrade your audio experience with the TLV320AC41CPT today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for various applications while ensuring longevity.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

Operating Mode: SYNCHRONOUS/ASYNCHRONOUS

Provides flexibility in operation, catering to different needs and requirements in audio processing.

Power Supplies (V): 3

Works efficiently with a common voltage supply, ensuring compatibility with existing systems.

No. of Terminals: 48

Offers extensive connectivity options, allowing for versatile configurations and compatibility with various setups.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables a compact design and efficient use of space, ideal for devices where size constraints are a consideration.

Maximum Operating Temperature: 70 °C

Ensures reliable performance even under higher temperatures, making it suitable for a wide range of environments.

Minimum Operating Temperature: 0 °C

Operates effectively in low-temperature conditions, ensuring consistent performance in various climates.

Linear Coding: 13-BIT

Provides high-resolution audio processing, delivering clear and accurate sound quality.

Maximum Seated Height: 1.6 mm

Minimal profile allows for a slim and sleek design, suitable for space-constrained applications.

Width: 7 mm

Compact dimensions enhance the product's versatility and ease of integration in different electronic devices.

Companding Law: A-LAW

Utilizes an efficient companding algorithm for audio compression and expansion, ensuring optimal sound quality.

Length: 7 mm

Compact size facilitates a space-efficient layout, contributing to the overall compactness of the product.

Temperature Grade: COMMERCIAL

Adheres to commercial standards, ensuring compatibility and reliability in commercial audio applications.

Technology: CMOS

Utilizes CMOS technology for efficient power management and high-performance audio processing capabilities.

Terminal Form: GULL WING

Gull wing terminals provide reliable solder connections, enhancing durability and ease of assembly.

Maximum Supply Current: 7.5 mA

Low power consumption ensures energy efficiency and prolongs battery life in portable audio devices.

Telecom IC Type: PCM CODEC

Suitable for use in telecom applications, offering high-quality voice encoding and decoding for clear communication.

Nominal Supply Voltage: 3 V

Nominal voltage requirement ensures compatibility with standard power sources, simplifying integration.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting, enabling compact and efficient circuit layouts.

Maximum Gain Tolerance: 1 dB

Accurate gain control ensures consistent audio levels, delivering reliable performance in diverse settings.

Filter: YES

Incorporation of a filter enhances audio quality by reducing noise and interference, ensuring clear and crisp sound output.

Technical Specifications

Audio Codecs TLV320AC41CPT attributes and parameters. Explore more Audio Codecs devices from Texas Instruments

Specs

Companding Law:

A-LAW

Filter:

YES

Maximum Gain Tolerance:

1 dB

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Linear Coding:

13-BIT

No. of Functions:

1

No. of Terminals:

48

Operating Mode:

SYNCHRONOUS/ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Codecs

Maximum Supply Current:

7.5 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

TLV320AC41CPT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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