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TBP24S81-55N

Texas Instruments

TBP24S81-55N by Texas Instruments

TBP24S81-55N by Texas Instruments is a 2KX4 OTP ROM with 8192-bit memory density and 55ns max access time. It operates b/w 0°C to 70°C, ideal for commercial applications requiring reliable non-volatile memory storage in a rectangular plastic/epoxy package with 18 terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,513 parts In-Stock

1+ parts

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4,513

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Vyrian

USA . 2,699 parts In-Stock

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2,699

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 814 parts In-Stock

1+ parts

$2.727

100+ parts

-

1k+ parts

$3.210

10k+ parts

-

814

$2.727

-

$3.210

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ChromeModa Solutions

Germany . 419 parts In-Stock

1+ parts

$3.064

100+ parts

$2.512

1k+ parts

-

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419

$3.064

$2.512

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IDEA Electronic Components Group

UK . 376 parts In-Stock

1+ parts

$3.064

100+ parts

-

1k+ parts

$2.758

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376

$3.064

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$2.758

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AZTECH Wire

Italy . 700 parts In-Stock

1+ parts

$8.386

100+ parts

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700

$8.386

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One Stop Electronics

USA . 231 parts In-Stock

1+ parts

$26.000

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231

$26.000

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Corphita

USA . 4,907 parts In-Stock

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4,907

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DigiPath Technology Company

USA . 1,372 parts In-Stock

1+ parts

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$2.763

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1,372

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$2.763

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Overview

Discover the TBP24S81-55N by Texas Instruments, a top-quality OTP ROM that offers reliability and performance. With a reputation for excellence, Texas Instruments ensures this product meets the highest standards in the industry. Ideal for a wide range of applications, this OTP ROM provides customers with fast access times and high memory density, making it a valuable asset for any project. Trust Texas Instruments for cutting-edge technology and innovative solutions that deliver unmatched benefits to meet your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

No. of Terminals: 18

Sufficient number of terminals for connecting the product to other components in a circuit.

Maximum Operating Temperature: 70 °C

Can operate at relatively high temperatures without affecting performance, suitable for various environments.

Organization: 2KX4

Efficient organization of memory cells that allows for effective storage and retrieval of data.

Technology: TTL

TTL technology ensures reliability and compatibility with many systems and circuits.

Memory Width: 4

Wide memory width enables storage of more data, enhancing the capabilities of the product.

Maximum Access Time: 55 ns

Fast access time ensures quick retrieval of data, improving overall performance.

Technical Specifications

OTP ROM TBP24S81-55N attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

55 ns

JESD-30 Code:

R-PDIP-T18

Memory Density:

8192 bit

Memory IC Type:

Memory Width:

4

No. of Terminals:

18

No. of Words:

2048 words

No. of Words Code:

2K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

2KX4

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

OTP ROMs

Maximum Supply Current:

175 mA

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TBP24S81-55N Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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