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SN74V3690-6PEU

Texas Instruments

SN74V3690-6PEU by Texas Instruments

SN74V3690-6PEU by Texas Instruments is a FIFO memory with 32Kx36 organization, 18-bit alternate memory width, and 3.3V nominal voltage. It operates synchronously with a cycle time of 6ns and is suitable for applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

$42.109

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 374 parts In-Stock

1+ parts

$34.304

100+ parts

$30.493

1k+ parts

$22.421

10k+ parts

-

374

$34.304

$30.493

$22.421

-

Mouser Electronics

USA . 3 parts In-Stock

1+ parts

$64.700

100+ parts

$53.150

1k+ parts

-

10k+ parts

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3

$64.700

$53.150

-

-

Rochester

USA . 221 parts In-Stock

1+ parts

-

100+ parts

$37.430

1k+ parts

$33.490

10k+ parts

$31.520

221

-

$37.430

$33.490

$31.520

DigiKey

USA . 221 parts In-Stock

1+ parts

-

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-

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221

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Verical

USA . 101 parts In-Stock

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-

100+ parts

$46.788

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-

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101

-

$46.788

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$28.917

100+ parts

-

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10

$28.917

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-

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Digiode

USA . 2,107 parts In-Stock

1+ parts

$32.589

100+ parts

-

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2,107

$32.589

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-

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Vyrian

USA . 3,910 parts In-Stock

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-

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3,910

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LWI Electronics Inc

India . 18 parts In-Stock

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18

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 344 parts In-Stock

1+ parts

$2.338

100+ parts

-

1k+ parts

$2.838

10k+ parts

-

344

$2.338

-

$2.838

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DigiPath Technology Company

USA . 1,876 parts In-Stock

1+ parts

$2.574

100+ parts

$2.369

1k+ parts

-

10k+ parts

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1,876

$2.574

$2.369

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IDEA Electronic Components Group

UK . 1,453 parts In-Stock

1+ parts

$2.627

100+ parts

-

1k+ parts

$2.364

10k+ parts

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1,453

$2.627

-

$2.364

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ChromeModa Solutions

Germany . 1,123 parts In-Stock

1+ parts

$2.627

100+ parts

$2.154

1k+ parts

-

10k+ parts

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1,123

$2.627

$2.154

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Aranea Global

USA . 500 parts In-Stock

1+ parts

$28.339

100+ parts

-

1k+ parts

$27.206

10k+ parts

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500

$28.339

-

$27.206

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Ampacity Inc.

Singapore . 214 parts In-Stock

1+ parts

$29.160

100+ parts

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214

$29.160

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Corphita

USA . 749 parts In-Stock

1+ parts

$30.874

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749

$30.874

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A-Z Elektronik GmbH

Germany . 7,431 parts In-Stock

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7,431

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Kepictronics

USA . 6,000 parts In-Stock

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6,000

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

1+ parts

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6,000

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Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

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3,000

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GreenTree Electronics

Israel . 837 parts In-Stock

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837

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Overview

Upgrade your system with the Texas Instruments SN74V3690-6PEU FIFO memory IC, offering high-quality performance and reliability. With a compact flatpack design and low profile, this synchronous operating mode device is perfect for a wide range of applications. Enjoy seamless data transfer with a cycle time of just 6 ns and a maximum clock frequency of 1 MHz. Trust in Texas Instruments' renowned expertise to provide you with the best-in-class solutions for your needs. Elevate your projects with the SN74V3690-6PEU and experience superior functionality and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the FIFO, ensuring reliable performance and longevity.

Cycle Time: 6 ns

The fast cycle time of 6 ns allows for efficient data transfer and processing, making this FIFO suitable for high-speed applications.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures coordinated and accurate data transfers within the FIFO, minimizing errors and improving overall system performance.

Maximum Clock Frequency (fCLK): 1 MHz

With a maximum clock frequency of 1 MHz, this FIFO can handle high-speed data processing and synchronization requirements effectively.

Memory IC Type: OTHER FIFO

Being a FIFO memory IC, this product is specifically designed for First-In-First-Out data storage and retrieval, making it an ideal choice for applications requiring sequential data handling.

Technical Specifications

FIFO SN74V3690-6PEU attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

4.5 ns

Alternate Memory Width:

18

Maximum Clock Frequency (fCLK):

1 MHz

Cycle Time:

6 ns

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e4

Length:

20 mm

Memory Density:

1179648 bit

Memory IC Type:

Memory Width:

36

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

128

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

32KX36

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

220

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

FIFOs

Maximum Supply Current:

40 mA

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

20

Width:

14 mm

Trade Compliance

SN74V3690-6PEU Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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