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SN74V283-6PZA

Texas Instruments

SN74V283-6PZA by Texas Instruments

SN74V283-6PZA by Texas Instruments is a FIFO with 32Kx18 organization, operating at 166MHz with 6ns cycle time. It features a 3.3V nominal voltage and is suitable for applications requiring fast synchronous data transfer in commercial-grade environments.

Median Price

$44.618

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 346 parts In-Stock

1+ parts

-

100+ parts

$39.660

1k+ parts

$35.490

10k+ parts

$33.400

346

-

$39.660

$35.490

$33.400

DigiKey

USA . 346 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

346

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-

-

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Verical

USA . 273 parts In-Stock

1+ parts

-

100+ parts

$49.575

1k+ parts

$44.362

10k+ parts

$41.750

273

-

$49.575

$44.362

$41.750

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,986 parts In-Stock

1+ parts

$41.876

100+ parts

-

1k+ parts

-

10k+ parts

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1,986

$41.876

-

-

-

Vyrian

USA . 8,172 parts In-Stock

1+ parts

-

100+ parts

-

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8,172

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LWI Electronics Inc

India . 15 parts In-Stock

1+ parts

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15

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 834 parts In-Stock

1+ parts

$3.248

100+ parts

-

1k+ parts

$3.769

10k+ parts

-

834

$3.248

-

$3.769

-

DigiPath Technology Company

USA . 581 parts In-Stock

1+ parts

$3.576

100+ parts

$3.290

1k+ parts

-

10k+ parts

-

581

$3.576

$3.290

-

-

ChromeModa Solutions

Germany . 2,901 parts In-Stock

1+ parts

$3.649

100+ parts

$2.992

1k+ parts

-

10k+ parts

-

2,901

$3.649

$2.992

-

-

IDEA Electronic Components Group

UK . 379 parts In-Stock

1+ parts

$3.649

100+ parts

-

1k+ parts

$3.284

10k+ parts

-

379

$3.649

-

$3.284

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Corphita

USA . 4,348 parts In-Stock

1+ parts

$39.672

100+ parts

-

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4,348

$39.672

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Microchip USA

USA . 447 parts In-Stock

1+ parts

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447

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Overview

Experience seamless data transfer and reliable performance with the Texas Instruments SN74V283-6PZA FIFO memory. Designed with precision and quality in mind, this FIFO memory is perfect for a wide range of applications. Whether you're in need of high-speed data processing or reliable storage solutions, this product offers unmatched value and benefits. Trust in Texas Instruments' reputation for excellence and choose the SN74V283-6PZA for all your memory needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the FIFO, ensuring longevity and reliability.

Cycle Time: 6 ns

With a fast cycle time of 6 ns, this FIFO can efficiently handle data transfer and processing tasks, making it suitable for high-speed applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard voltage of 3.3V, making it compatible with a wide range of systems and components.

Maximum Clock Frequency (fCLK): 166 MHz

Capable of operating at a high clock frequency of 166 MHz, allowing for rapid data transfer and processing speeds.

Memory IC Type: OTHER FIFO

Specifically designed as a FIFO memory IC, ensuring efficient data handling and storage capabilities.

Technical Specifications

FIFO SN74V283-6PZA attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

4.5 ns

Additional Features:

CAN ALSO BE CONFIGURED AS 65536 X 9

Alternate Memory Width:

9

Maximum Clock Frequency (fCLK):

166 MHz

Cycle Time:

6 ns

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

14 mm

Memory Density:

589824 bit

Memory IC Type:

Memory Width:

18

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

80

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

32KX18

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.015 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

35 mA

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

SN74V283-6PZA Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.B

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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