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SN74V273-7PZA

Texas Instruments

SN74V273-7PZA by Texas Instruments

SN74V273-7PZA by Texas Instruments is a FIFO memory with 16Kx18 organization, operating at 133 MHz with a cycle time of 7.5 ns. It has a low profile flatpack package and is suitable for applications requiring fast synchronous data storage and retrieval in commercial temperature environments.

Median Price

$21.665

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 251 parts In-Stock

1+ parts

-

100+ parts

$23.230

1k+ parts

-

10k+ parts

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251

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$23.230

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-

Rochester

USA . 208 parts In-Stock

1+ parts

-

100+ parts

$20.100

1k+ parts

$17.990

10k+ parts

$16.930

208

-

$20.100

$17.990

$16.930

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,545 parts In-Stock

1+ parts

$21.223

100+ parts

-

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10k+ parts

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2,545

$21.223

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Vyrian

USA . 2,508 parts In-Stock

1+ parts

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2,508

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,416 parts In-Stock

1+ parts

$3.295

100+ parts

-

1k+ parts

$3.818

10k+ parts

-

1,416

$3.295

-

$3.818

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ChromeModa Solutions

Germany . 2,300 parts In-Stock

1+ parts

$3.702

100+ parts

$3.036

1k+ parts

-

10k+ parts

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2,300

$3.702

$3.036

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IDEA Electronic Components Group

UK . 2,209 parts In-Stock

1+ parts

$3.702

100+ parts

-

1k+ parts

$3.332

10k+ parts

-

2,209

$3.702

-

$3.332

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$6.380

100+ parts

$5.806

1k+ parts

$5.232

10k+ parts

-

2,500

$6.380

$5.806

$5.232

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Corphita

USA . 3,204 parts In-Stock

1+ parts

$20.106

100+ parts

-

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3,204

$20.106

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Microchip USA

USA . 264 parts In-Stock

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264

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DigiPath Technology Company

USA . 14 parts In-Stock

1+ parts

-

100+ parts

$3.338

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14

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$3.338

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Overview

Discover the Texas Instruments SN74V273-7PZA, a top-of-the-line FIFO memory IC that combines cutting-edge technology with unparalleled reliability. With a 16Kx18 organization and a maximum clock frequency of 133 MHz, this device is perfect for high-speed data storage applications. The robust construction and advanced features make it ideal for demanding industrial environments where precision and performance are paramount. Trust Texas Instruments to deliver exceptional quality and innovation in every product, ensuring that your projects run smoothly and efficiently. Choose the SN74V273-7PZA for seamless integration, superior functionality, and unmatched value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers good protection for the internal components of the FIFO, making it durable and reliable.

Cycle Time: 7.5 ns

The fast cycle time of 7.5 ns ensures quick and efficient data storage and retrieval in the FIFO.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V allows for compatibility with a wide range of systems and applications.

Maximum Clock Frequency (fCLK): 133 MHz

With a high maximum clock frequency of 133 MHz, the FIFO can handle data at a fast pace, suitable for high-speed applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making the FIFO efficient and reliable.

Memory Density: 294912 bit

High memory density allows for storing a large amount of data in the FIFO, making it suitable for complex applications.

Technical Specifications

FIFO SN74V273-7PZA attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

5 ns

Additional Features:

CAN ALSO BE CONFIGURED AS 32768 X 9

Alternate Memory Width:

9

Maximum Clock Frequency (fCLK):

133 MHz

Cycle Time:

7.5 ns

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

14 mm

Memory Density:

294912 bit

Memory IC Type:

Memory Width:

18

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

80

No. of Words:

16384 words

No. of Words Code:

16K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

16KX18

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.015 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

35 mA

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

SN74V273-7PZA Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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