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SN74V273-10PZA

Texas Instruments

SN74V273-10PZA by Texas Instruments

SN74V273-10PZA by Texas Instruments is a FIFO memory with 16Kx18 organization, 10ns cycle time, and 100MHz clock frequency. It operates synchronously at 3.3V and is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

$30.364

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 360 parts In-Stock

1+ parts

-

100+ parts

$26.990

1k+ parts

$24.150

10k+ parts

$22.730

360

-

$26.990

$24.150

$22.730

DigiKey

USA . 360 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

360

-

-

-

-

Verical

USA . 360 parts In-Stock

1+ parts

-

100+ parts

$33.737

1k+ parts

$30.188

10k+ parts

$28.413

360

-

$33.737

$30.188

$28.413

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,943 parts In-Stock

1+ parts

$28.490

100+ parts

-

1k+ parts

-

10k+ parts

-

2,943

$28.490

-

-

-

Vyrian

USA . 2,466 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,466

-

-

-

-

DigiKey Marketplace

USA . 360 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

360

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,055 parts In-Stock

1+ parts

$2.054

100+ parts

$190.756

1k+ parts

$1.849

10k+ parts

-

2,055

$2.054

$190.756

$1.849

-

DigiPath Technology Company

USA . 145 parts In-Stock

1+ parts

$2.262

100+ parts

$2.081

1k+ parts

-

10k+ parts

-

145

$2.262

$2.081

-

-

ChromeModa Solutions

Germany . 5,633 parts In-Stock

1+ parts

$2.308

100+ parts

$1.893

1k+ parts

-

10k+ parts

-

5,633

$2.308

$1.893

-

-

IDEA Electronic Components Group

UK . 1,523 parts In-Stock

1+ parts

$2.308

100+ parts

-

1k+ parts

$2.077

10k+ parts

-

1,523

$2.308

-

$2.077

-

Corphita

USA . 3,765 parts In-Stock

1+ parts

$26.991

100+ parts

-

1k+ parts

-

10k+ parts

-

3,765

$26.991

-

-

-

Microchip USA

USA . 426 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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426

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-

-

-

Overview

Unlock seamless data transfer and storage with the SN74V273-10PZA by Texas Instruments, a high-quality FIFO memory IC designed for reliability and efficiency. Perfect for a wide range of applications, this synchronous operating mode device offers a nominal supply voltage of 3.3V, ensuring optimal performance. With a fast cycle time of 10ns and a maximum clock frequency of 100MHz, this FLATPACK, LOW PROFILE package boasts 16KX18 organization and 3-STATE output characteristics. Trust in Texas Instruments to deliver cutting-edge technology that meets your demanding requirements and enhances your projects with superior functionality and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the FIFO, making it reliable for long-term use.

Cycle Time: 10 ns

The fast cycle time of 10 ns ensures quick access to data in the FIFO, making it suitable for high-speed applications where time-sensitive data processing is required.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V nominal supply voltage ensures compatibility with common electronic systems and power sources, making integration of the FIFO easier in various applications.

Maximum Clock Frequency (fCLK): 100 MHz

The high maximum clock frequency of 100 MHz allows for rapid data transfer and processing within the FIFO, making it ideal for demanding tasks that require quick data retrieval and storage.

Memory Density: 294912 bit

The high memory density of 294912 bits provides ample storage capacity for data in the FIFO, making it suitable for applications that require large amounts of data to be stored and accessed quickly.

Technical Specifications

FIFO SN74V273-10PZA attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

6.5 ns

Additional Features:

CAN ALSO BE CONFIGURED AS 32768 X 9

Alternate Memory Width:

9

Maximum Clock Frequency (fCLK):

100 MHz

Cycle Time:

10 ns

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

14 mm

Memory Density:

294912 bit

Memory IC Type:

Memory Width:

18

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

80

No. of Words:

16384 words

No. of Words Code:

16K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

16KX18

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.015 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

35 mA

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

SN74V273-10PZA Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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