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SN74V263-10PZA

Texas Instruments

SN74V263-10PZA by Texas Instruments

SN74V263-10PZA by Texas Instruments is a FIFO with 8Kx18 organization, 100 MHz clock frequency, and 10 ns cycle time. It operates synchronously at a voltage of 3.3V and is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

$17.270

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 518 parts In-Stock

1+ parts

-

100+ parts

$14.950

1k+ parts

$13.380

10k+ parts

$12.590

518

-

$14.950

$13.380

$12.590

DigiKey

USA . 518 parts In-Stock

1+ parts

-

100+ parts

$17.270

1k+ parts

-

10k+ parts

-

518

-

$17.270

-

-

Verical

USA . 360 parts In-Stock

1+ parts

-

100+ parts

$18.688

1k+ parts

$16.725

10k+ parts

$15.738

360

-

$18.688

$16.725

$15.738

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,565 parts In-Stock

1+ parts

$15.780

100+ parts

-

1k+ parts

-

10k+ parts

-

1,565

$15.780

-

-

-

Vyrian

USA . 4,768 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,768

-

-

-

-

DigiKey Marketplace

USA . 518 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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-

518

-

-

-

-

LWI Electronics Inc

India . 3 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 85 parts In-Stock

1+ parts

$5.099

100+ parts

-

1k+ parts

$5.681

10k+ parts

-

85

$5.099

-

$5.681

-

ChromeModa Solutions

Germany . 6,497 parts In-Stock

1+ parts

$5.729

100+ parts

$4.698

1k+ parts

-

10k+ parts

-

6,497

$5.729

$4.698

-

-

IDEA Electronic Components Group

UK . 2,052 parts In-Stock

1+ parts

$5.729

100+ parts

-

1k+ parts

$5.156

10k+ parts

-

2,052

$5.729

-

$5.156

-

Corphita

USA . 1,938 parts In-Stock

1+ parts

$14.949

100+ parts

-

1k+ parts

-

10k+ parts

-

1,938

$14.949

-

-

-

A-Z Elektronik GmbH

Germany . 6,167 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,167

-

-

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DigiPath Technology Company

USA . 869 parts In-Stock

1+ parts

-

100+ parts

$5.165

1k+ parts

-

10k+ parts

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869

-

$5.165

-

-

Microchip USA

USA . 287 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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287

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-

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Overview

Experience unparalleled reliability and performance with the Texas Instruments SN74V263-10PZA FIFO memory IC. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that meet the highest standards. Ideal for a wide range of applications, this FIFO memory offers seamless operation and efficient data storage. Trust Texas Instruments to provide you with the superior value and advantages you need to stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components of the FIFO, ensuring long-term reliability.

Cycle Time: 10 ns

The fast cycle time of 10 ns allows for quick data transfer and processing, making this FIFO ideal for high-speed applications where timing is critical.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures that data is transferred at a consistent rate, minimizing the risk of errors and improving overall system performance.

Nominal Supply Voltage: 3.3V

The 3.3V nominal supply voltage is a common standard in many electronic devices, making it compatible with a wide range of systems and applications.

Maximum Operating Temperature: 70°C

The high maximum operating temperature of 70°C allows the FIFO to function reliably in a variety of environmental conditions and applications.

Technology: CMOS

The CMOS technology used in this FIFO offers low power consumption and high noise immunity, making it energy-efficient and reliable for long-term use.

Memory IC Type: OTHER FIFO

The use of FIFO memory IC type provides efficient data storage and retrieval capabilities, making this product suitable for buffering and queuing applications.

Technical Specifications

FIFO SN74V263-10PZA attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

6.5 ns

Additional Features:

CAN ALSO BE CONFIGURED AS 16384 X 9

Alternate Memory Width:

9

Maximum Clock Frequency (fCLK):

100 MHz

Cycle Time:

10 ns

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

14 mm

Memory Density:

147456 bit

Memory IC Type:

Memory Width:

18

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

80

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

8KX18

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.015 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

35 mA

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

SN74V263-10PZA Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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