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SN74LS384NP3

Texas Instruments

SN74LS384NP3 by Texas Instruments

SN74LS384NP3 by Texas Instruments is a DSP peripheral IC with TTL technology. It features 16 terminals in an in-line package style, operating b/w 0°C to 70°C. Ideal for applications requiring a commercial-grade multiplier, this rectangular plastic/epoxy package is designed for through-hole mounting at a pitch of 2.54mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,218 parts In-Stock

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Digiode

USA . 3,559 parts In-Stock

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3,559

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Distributors (Availability)

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AZTECH Wire

Italy . 224 parts In-Stock

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$13.479

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$13.479

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One Stop Electronics

USA . 899 parts In-Stock

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$18.000

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899

$18.000

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Parana Technologies

USA . 496 parts In-Stock

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$18.560

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$18.666

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$18.560

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$18.666

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IDEA Electronic Components Group

UK . 2,011 parts In-Stock

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$20.854

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$19.811

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$18.769

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2,011

$20.854

$19.811

$18.769

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ChromeModa Solutions

Germany . 1,082 parts In-Stock

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$20.854

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$17.100

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1,082

$20.854

$17.100

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Corohmni

South Africa . 3,239 parts In-Stock

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$26.395

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Corphita

USA . 4,490 parts In-Stock

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DigiPath Technology Company

USA . 20 parts In-Stock

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$18.802

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Overview

Unleash the power of cutting-edge technology with the SN74LS384NP3 by Texas Instruments. Designed for high-performance DSP peripherals, this innovative product offers unparalleled quality and reliability. Whether you're in the market for efficient multipliers or versatile peripherals, this product delivers exceptional value and benefits. With a durable plastic/epoxy package and a wide operating temperature range, the SN74LS384NP3 is perfect for a variety of applications. Trust Texas Instruments to provide the best in DSP peripherals for all your technological needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection to the internal components of the DSP peripheral, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration and installation of the DSP peripheral within electronic systems or devices.

No. of Terminals: 16

With 16 terminals, this DSP peripheral can support multiple connections and data transfer, enhancing its versatility and functionality.

Maximum Operating Temperature: 70 °C

A high maximum operating temperature of 70°C ensures the DSP peripheral can function optimally even in demanding or harsh environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C provides flexibility in using the DSP peripheral in various temperature conditions without compromising performance.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliability and stable performance of the DSP peripheral in standard operating conditions typically found in commercial applications.

Peripheral IC Type: DSP PERIPHERAL, MULTIPLIER

Being a DSP peripheral with a multiplier function, this product is designed for efficient processing of signals and data, making it ideal for digital signal processing applications.

Technology: TTL

TTL technology offers high-speed and reliable digital signal processing capabilities, ensuring fast and accurate performance of the DSP peripheral.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, the DSP peripheral facilitates easy connection and integration with other electronic components or PCBs, simplifying the overall design process.

Technical Specifications

DSP Peripherals SN74LS384NP3 attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

DSP Peripherals

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

SN74LS384NP3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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