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SN7480NP1

Texas Instruments

SN7480NP1 by Texas Instruments

SN7480NP1 by Texas Instruments is a DSP peripheral IC with 14 terminals in an inline package. Operating temperature range of 0-70°C, suitable for commercial applications. Features TTL technology and serves as a multiplier in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,824 parts In-Stock

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Vyrian

USA . 2,303 parts In-Stock

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2,303

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Distributors (Availability)

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AZTECH Wire

Italy . 322 parts In-Stock

1+ parts

$5.587

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322

$5.587

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One Stop Electronics

USA . 605 parts In-Stock

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$21.000

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605

$21.000

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Corohmni

South Africa . 724 parts In-Stock

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$52.785

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724

$52.785

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Parana Technologies

USA . 1,916 parts In-Stock

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$74.473

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1,916

$74.473

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DigiPath Technology Company

USA . 1,039 parts In-Stock

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$82.003

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1,039

$82.003

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IDEA Electronic Components Group

UK . 1,833 parts In-Stock

1+ parts

$83.677

100+ parts

$79.493

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$75.309

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1,833

$83.677

$79.493

$75.309

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ChromeModa Solutions

Germany . 542 parts In-Stock

1+ parts

$83.677

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$68.615

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542

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Corphita

USA . 2,976 parts In-Stock

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2,976

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Overview

Unlock the power of digital signal processing with the SN7480NP1 by Texas Instruments. Crafted with precision and expertise, this DSP peripheral offers unparalleled quality and reliability. Ideal for a wide range of applications, this product seamlessly integrates into your projects to deliver exceptional performance. Experience the value and benefits of choosing Texas Instruments for your electronic needs, and elevate your creations to new heights with the SN7480NP1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or handheld devices.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into circuit board layouts, optimizing space efficiency.

No. of Terminals: 14

Having 14 terminals provides sufficient connectivity options for interfacing with other components or devices in a system.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can withstand challenging environmental conditions without compromising performance.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable operation in standard temperature settings typically found in commercial applications.

Peripheral IC Type: DSP PERIPHERAL, MULTIPLIER

Being a DSP peripheral with a multiplier function, this product offers enhanced computational capabilities for signal processing tasks.

Technology: TTL

The TTL technology provides compatibility with a wide range of digital systems, making it versatile and easy to integrate into existing setups.

Terminal Form: THROUGH-HOLE

The through-hole terminals offer strong mechanical connections, ensuring stability and reliability in demanding operating conditions.

Technical Specifications

DSP Peripherals SN7480NP1 attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T14

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

DSP Peripherals

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

SN7480NP1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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