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SN74LS261N3

Texas Instruments

SN74LS261N3 by Texas Instruments

SN74LS261N3 by Texas Instruments is a DSP peripheral IC with TTL technology. It features 16 terminals in an in-line rectangular package, operating b/w 0°C to 70°C. Ideal for applications requiring a commercial-grade dual terminal multiplier in through-hole form factor with 2.54mm pitch.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,712 parts In-Stock

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8,712

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Digiode

USA . 2,733 parts In-Stock

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2,733

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 217 parts In-Stock

1+ parts

$13.436

100+ parts

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217

$13.436

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Parana Technologies

USA . 200 parts In-Stock

1+ parts

$23.019

100+ parts

-

1k+ parts

$23.664

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200

$23.019

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$23.664

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IDEA Electronic Components Group

UK . 1,243 parts In-Stock

1+ parts

$25.864

100+ parts

$24.571

1k+ parts

$23.278

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1,243

$25.864

$24.571

$23.278

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ChromeModa Solutions

Germany . 1,202 parts In-Stock

1+ parts

$25.864

100+ parts

$21.208

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-

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1,202

$25.864

$21.208

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One Stop Electronics

USA . 225 parts In-Stock

1+ parts

$34.000

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225

$34.000

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Corohmni

South Africa . 218 parts In-Stock

1+ parts

$77.459

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218

$77.459

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Corphita

USA . 2,141 parts In-Stock

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2,141

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DigiPath Technology Company

USA . 354 parts In-Stock

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$23.319

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354

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$23.319

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Overview

Elevate your digital signal processing capabilities with the SN74LS261N3 by Texas Instruments. Known for their superior quality and innovation, Texas Instruments delivers high-performance DSP peripherals that excel in a variety of applications. From audio processing to telecommunications, this multiplier offers unmatched precision and reliability. Experience seamless integration and enhanced efficiency with this versatile product. Upgrade your system today and unlock endless possibilities with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space in electronic designs, making it easier to integrate into compact systems.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options, allowing for versatile integration with other components or systems.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand moderate heat levels, ensuring reliable performance in various environments.

Technology: TTL

TTL technology offers fast signal processing and compatibility with other TTL components, making this product efficient and easy to integrate into existing systems.

Technical Specifications

DSP Peripherals SN74LS261N3 attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

DSP Peripherals

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

SN74LS261N3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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