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SN7480NP3

Texas Instruments

SN7480NP3 by Texas Instruments

SN7480NP3 by Texas Instruments is a DSP peripheral with 14 terminals in an inline package. Operating temperature range of 0-70°C, suitable for commercial applications. Features TTL technology and serves as a multiplier in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,069 parts In-Stock

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3,069

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Vyrian

USA . 2,015 parts In-Stock

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2,015

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Distributors (Availability)

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AZTECH Wire

Italy . 338 parts In-Stock

1+ parts

$15.007

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338

$15.007

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One Stop Electronics

USA . 1,521 parts In-Stock

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$35.000

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1,521

$35.000

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Corohmni

South Africa . 2,852 parts In-Stock

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$50.236

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2,852

$50.236

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Parana Technologies

USA . 52 parts In-Stock

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$70.721

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52

$70.721

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DigiPath Technology Company

USA . 310 parts In-Stock

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$77.873

100+ parts

$71.643

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310

$77.873

$71.643

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ChromeModa Solutions

Germany . 1,974 parts In-Stock

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$79.462

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$65.159

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1,974

$79.462

$65.159

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IDEA Electronic Components Group

UK . 208 parts In-Stock

1+ parts

$79.462

100+ parts

$75.489

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$71.516

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208

$79.462

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$71.516

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Corphita

USA . 4,471 parts In-Stock

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Overview

Unlock endless possibilities with the SN7480NP3 by Texas Instruments, a top-tier DSP Peripheral that sets new standards in performance and reliability. Crafted with precision using high-quality materials, this product boasts unparalleled durability and efficiency. Whether you're working on audio processing, image recognition, or data analysis, the SN7480NP3 delivers exceptional results every time. Experience seamless integration, advanced functionality, and smooth operation with this cutting-edge solution. Elevate your projects to new heights and achieve unmatched success with the SN7480NP3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product easy to handle and less prone to damage during handling or transportation.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space, making it easier to integrate the product into a design or system without wasting valuable real estate.

No. of Terminals: 14

With 14 terminals, this product provides ample connectivity options, allowing for versatile integration with other components or peripherals.

Package Style (Meter): IN-LINE

The in-line package style is convenient for space-constrained applications, as it allows for a more compact and streamlined design.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliable performance even in challenging environments or under heavy loads.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C means that this product can operate effectively in a wide range of temperature conditions, ensuring flexibility in deployment.

Terminal Position: DUAL

Dual terminal position allows for better stability and connectivity, minimizing the risk of signal interference or loss.

Temperature Grade: COMMERCIAL

Designed for commercial use, this product is suitable for a wide range of applications in industries and sectors that do not require extreme temperature resistance or durability.

Peripheral IC Type: DSP PERIPHERAL, MULTIPLIER

This product features a DSP peripheral type with multiplier functionality, providing enhanced processing power and efficiency for complex computational tasks.

Technology: TTL

TTL technology offers fast and reliable signal processing, making this product suitable for high-speed data transmission and digital signal processing applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form ensures secure and reliable connections, ideal for applications where soldering or mechanical stability is a priority.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, this product allows for easy and precise connections, simplifying installation and assembly processes.

Technical Specifications

DSP Peripherals SN7480NP3 attributes and parameters. Explore more DSP Peripherals devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T14

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

DSP Peripherals

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Peripheral IC Type:

Trade Compliance

SN7480NP3 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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